Daniel101285Daniel101285

Willkommen im sysProfile nr: 193268

Profil geändert: 04.10.2018, 16:00
Profil erstellt: 26.07.2016, 07:29
Anzahl Views: 653
 
     






Daniel101285's System is powered by...

AMD ProzessoriNTEL ProzessorASRockFoxConn MotherboardsCorsairMicron Technologyelpida

SeagateSamsungEVGAATi CrossFireNvidia SLI TechnologienVidia GeForceRealtek

vodafoneKabel DeutschlandMicrosoft WindowsAVM Fritz!SaitekLogiTechLG

SMC NetworksBeQuietGELIDProtechnicProlimaTechAvanceThermalTakeMicroSoft

PhilipsSONY



Preis/Leistung

75%
Silence

50%
RechenPower

50%
GamingPower

100%
Cooles Design

50%



     
 

Corsair Vengeance LPX CMK16GX4M2B3000C15
Corsair Vengeance LPX CMK16GX4M2B3000C15
Intel Core i7-6700K
Intel Core i7-6700K
ASRock Z170 Extreme4
ASRock Z170 Extreme4
 
Corsair Vengeance LPX CMK16GX4M2B3000C15
Corsair Vengeance LPX CMK16GX4M2B3000C15
Corsair Vengeance LPX CMK16GX4M2B3000C15
Corsair Vengeance LPX CMK16GX4M2B3000C15
EVGA GeForce GTX 970 SSC GAMING ACX 2.0+ [04G-P4-3975-KR]
EVGA GeForce GTX 970 SSC GAMING ACX 2.0+ [04G-P4-3975-KR]
 
 
     



     
 

Prozessor: Integrated Electronics Corporation - Intel Core i7-6700K Sonstige Features:
Codename: Skylake-S "Sky Bay-DT" (Integrated Electronics Corporation - Intel Skylake Microarchitecture)
Architekt.: Quad-Core Processor
Revision: R0
Tech.: Integrated Electronics Corporation - Intel 3D Tri-Gate Transistor Technology: 14 nm Fin Field-Effect Transistor - FinFET (14FF)
F.M.S.: Integrated Electronics Corporation - Intel Core Gen6
Instruct.: MMX(+), AES-NI, CLMUL, FMA, FMA3, Intel 64, SSE, SSE2, SSE3, SSSE3, SSE4, SSE4.1, SSE4.2, AVX, AVX2, TXT, TSX, SGX, NX-Bit, XD-Bit, BMI, F16C, iAMT2, VT/VT-x, VT-d/Vi, Integrated Electronics Corporation - Intel Turbo Boost Technology 2.0, Integrated Electronics Corporation - Intel Hyper-Threading Technology (Thread-Level Parallelism & Instruction-Level Parallelism), Integrated Electronics Corporation - Intel Speed Shift Technology, Enhanced Integrated Electronics Corporation - Intel SpeedStep Technology, Core-based and Package-based State, Auto Halt (C1), Enhanced Halt State (C1E), Stop Clock/Stop Grant (C2), Extended Stop Grant State (C2E), Deep Sleep (C3), Deep Sleep State (C3E), Deeper Sleep (C4), Enhanced Deeper Sleep (C4E/C5), Deep Power Down (C6), Deeper Power Down (C7)
Socket: H4 (FCLGA-1151: Flip-Chip Land Grid Array)
CPU-Takt: Core State: 800 ~ 4000 MHz (Intel (Integrated Electronics Corporation - Intel Turbo Boost Technology 2.0: 4200 MHz)
Multiplik.: Integrated Electronics Corporation - Intel Ring On-Chip Interconnect: 8x ~ 40x (Integrated Electronics Corporation - Intel Turbo Boost Technology 2.0: 42x) / Integrated Electronics Corporation - Intel QuickPath Interconnect: 40x (Integrated Electronics Corporation - Intel Turbo Boost Technology 2.0: 42x)
FSB: Integrated Electronics Corporation - Intel Ring On-Chip Interconnect: 100 MHz / Integrated Electronics Corporation - Intel QuickPath Interconnect: 100 MHz
L1 Cache: 4x 32 KBytes Instruction Cache, 4x 32 KBytes Data Cache
L2 Cache: 4x 256 KBytes
L3 Cache: 8192 KBytes
Voltage: Core State: 0,780 ~ 1,264 V & CPUVID: 1,350 V / w/ ASRock Inc. Multi Core Enhancement: 1,344 V & CPUVID: 1,425 V (Integrated Electronics Corporation - Intel Turbo Boost Technology 2.0: 1,280 V & CPUVID: 1,350 V / w/ ASRock Inc. Multi Core Enhancement: 1,344 V & CPUVID: 1,425 V)
Besonderh.: Integrated Electronics Corporation - Intel HD Graphics 530 (Skylake-S GT2: Integrated Electronics Corporation - Intel Graphics Gen9) w/ Integrated Electronics Corporation - Intel Quick Sync Video 5, Integrated Electronics Corporation - Intel InTru 3D Technology, Integrated Electronics Corporation - Intel Clear Video HD Technology, Integrated Electronics Corporation - Intel Next-Generation Polymer Thermal Interface Material - NGPTIM, Integrated Memory Controller w/ Memory Management Unit, Unlocked Delay-Locked Loop & Unlocked Phase-Locked Loop (Variable CPU Multiplier), Integrated Electronics Corporation - Intel Power Control Unit
Kühlung: Listan GmbH & Co. KG - be quiet! Dark Rock Pro 3 [BK019] + 1x Listan GmbH & Co. KG - be quiet! Silent Wings 3 MID-SPEED PWM [BQ SIW3 13525-MF PWM] (135x135x22 mm, 1400 RPM, 67,8 CFM, 20,8 dB(A), DC 12,0 V / 0,40 A / 4,80 W, Fluid Dynamic Bearing) + 1x Dongguan Protechnic Electric Co., Ltd. - be quiet! Silent Wings 2 MID-SPEED PWM [BQT T12025-MF PWM] (120x120x25 mm, 1700 RPM, 57,2 CFM, 21,5 dB(A), DC 12,0 V / 0,20 A / 2,40 W, Fluid Dynamic Bearing)
Temperatur: Idle: 20 - 30 °C, Load: 40 - 75 °C w/ Thermal Interface Material: GELID Solutions Ltd. GC-Extreme & Prolimatech Inc. PK-3 Nano & Arctic Silver Inc. Céramique 2 (Tjunction @ Tcase (Integrated Electronics Corporation - Intel Platform Environment Control Interface) & Tcore (Integrated Electronics Corporation - Intel Digital Thermal Sensors))Kühler Vergleich
CPU-Z Vers.: CPUID CPU-Z 1.78.1

MainBoard: ASRock Inc. Z170 Extreme4 (w/o ASRock Inc./Hon Hai Precision Industry Co., Ltd. - Foxconn Electronics Inc. USB 3.1 Front Panel) (equal: ASRock Inc. Z170 Extreme4+ w/ ASRock Inc./Hon Hai Precision Industry Co., Ltd. - Foxconn Electronics Inc. USB 3.1 Front Panel)
Chipsatz: Integrated Electronics Corporation - Intel Z170
Northbridge: Integrated Electronics Corporation - Intel Core (Skylake-D QC) PCI Host Bridge/DRAM Registers (I/O Memory Management Unit) Memory Controller Hub Revision 07 + ASRock Inc. Super Alloy Digi Power - Hybrid Digital Voltage Regulator Module w/ 6+4 Digital Phase Power Design (VCCIA & VCCGT 4+3 Multi-Phase Hybrid PWM Regulator: Renaissance Semiconductor for Advanced Solutions Electronics Corporation - Renesas - Intersil Corporation ISL95856 w/ Advanced Power Electronics Corp. - APEC AP4028GEMT-HF & Advanced Power Electronics Corp. - APEC AP4024GEMT-HF w/ Multi-Phase Synchronous Rectified Buck Drivers & Gate Bridge: Renaissance Semiconductor for Advanced Solutions Electronics Corporation - Renesas - Intersil Corporation ISL6625A w/ Richtek Technology Corporation 5AZ XDL w/ FPCAP Electronics (Suzhou) Co., Ltd. - Nichicon Corporation FP12K Platinum Caps w/ ASRock Inc. Premium 38A Alloy Chokes; VCCIO & VCCSA Single-Phase Synchronous Rectified Buck PWM Controller: Richtek Technology Corporation RT8120B w/ Advanced Power Electronics Corp. - APEC AP4028GEMT-HF & Advanced Power Electronics Corp. - APEC AP4024GEMT-HF w/ FPCAP Electronics (Suzhou) Co., Ltd. - Nichicon Corporation FP12K Platinum Caps w/ ASRock Inc. Premium 38A Alloy Chokes; VDDQ & VDDP Single-Phase Synchronous Rectified Buck PWM Controller: Richtek Technology Corporation RT8120B w/ Advanced Power Electronics Corp. - APEC AP4028GEMT-HF & Advanced Power Electronics Corp. - APEC AP4024GEMT-HF w/ FPCAP Electronics (Suzhou) Co., Ltd. - Nichicon Corporation FP12K Platinum Caps w/ ASRock Inc. Premium 38A Alloy Chokes)
Southbridge: Integrated Electronics Corporation - Intel Sunrise Point-H GL82Z170 Platform Controller Hub Revision 31 (Lithograph: 22 nm) & USB 3.1 Gen1 eXtensible Host Controller Interface & PCIe PHY: ASMedia Technology Inc. ASM1142 & High Speed TMDS & LVDS Level Shift ICs for HDMI, DVI & DP w/ Integrated HPD: ASMedia Technology Inc. ASM1442K & PCI Express 3.0 & USB 3.1 Backplanes 4-Channel High-Performance Differential Switch: Texas Instruments Incorporated HD3SS3415 & USB 3.1 Type-C Power Delivery Switch w/ Integrated Logic Control: Etron Technology, Inc. EJ179V & 3.3V 4 Differential Channel 2:1 Multiplexer/Demultiplexer Switch for PCI Express Gen3: Royal Philips - Next eXPerience Semiconductors - NXP CBTL04083B
Revision: Revision 1.0
BiosVersion: American Megatrends Inc. - AMI Unified Extensible Firmware Interface - UEFI 5.0 / P7.50 (System Management Basic Input/Output System - SMBIOS 2.8, Dual Basic Input/Output System - DualBIOS, Advanced Configuration and Power Interface - ACPI 5.0, Integrated Electronics Corporation - Intel Management Engine Interface, Integrated Electronics Corporation - Intel Real-time Accelerated Processing of I/O Data - Rapid Storage Technology, Integrated Electronics Corporation - Intel Direct Media Interface 3.0, Integrated Electronics Corporation - Intel Turbo Boost Technology 2.0, NVIDIA Corporation SLI Technology, Advanced Micro Devices, Inc. - AMD CrossFireX Technology, ASRock Inc. Multi Core Enhancement, ASRock Inc. Hyper BCLK Engine (Phase-Locked Loop: Integrated Device Technology, Inc. - IDT6V41542NLG), ASRock Inc. BCLK Full-range Overclocking, ASRock Inc. A-Tuning w/ ASRock Inc. FAN-Tastic Tuning, ASRock Inc. Full Spike Protection)
Anschlüsse: 2x PCIe 3.0 x16 single @ x16 mode - dual @ x8 mode, 1x PCIe 3.0 x16 @ x4 mode, 3x PCIe 3.0 x1, 6x SATA3, 3x eSATA3, 1x M.2, 1x USB 3.1 Gen1 LPC, 2x USB 2.0 LPC, 6x PWM/DC LPCIO, 1x Thunderbolt AIC LPC, ATXPWR 24-Pin, ATX12V 8-Pin, 1x Dr. Debug w/ LED, 1x Power Switch w/ LED, 1x Reset Switch w/ LED
extern: 1x PS2, 1x USB 3.1 Gen2 Type-A, 1x USB 3.1 Gen2 Type-C, 6x USB 3.1 Gen1 Type-A, 1x DVI-D Dual-Link, 1x DisplayPort 1.2, 1x HDMI 1.4a, 1x LAN (RJ-45), 1x ODT (F05), 1x Audio 5.1 (TRS), 1x Clear CMOS Switch
Temperatur: Idle: 25 - 35 °C, Load: 35 - 40 °C
Kühlung: ASRock Inc. Super Alloy XXL Aluminum Alloy Heatsinks + Low Pin Count Super Input/Output Interface - LPCIO w/ Hardware Thermal Control - HTC: Nuvoton Technology Corp. NCT6791D + DC/PWM Auto-Detection Fan Driver PMIC: Nuvoton Technology Corp. NCT3943STR-ND

RAM: Corsair Memory Inc. Vengeance LPX CMK16GX4M2B3000C15 [v3.21] (equal: Corsair Memory Inc. Vengeance LPX CMK8GX4M1B3000C15 & Corsair Memory Inc. Vengeance LPX CMK32GX4M4B3000C15)
Size: 2x 8192 MB (16384 MB)
Typ: DDR4-SDRAM (PC4-24000U) [Micron Technology Inc. MT40A512M8RH-083E:B - 6K877-D9TGG]
Timing: 15-17-17-35-52-2N (CL-RCD-RP-RAS-RC-CR)
RAM-Takt: 1500 MHz (3000 MHz)
Voltage: 1,35 V
Ratio: 30x @100 MHz (FSB:DRAM Ratio)
Kühlung: Anodized Aluminum Heat Spreader
Grafikkarte: NVIDIA Corporation GeForce GTX 970
Subvendor: EVGA Corporation GeForce GTX 970 SSC GAMING ACX 2.0+ [04G-P4-3975-KR]
Chipsatz: GM204-200-A1 (NVIDIA Corporation Maxwell Microarchitecture)
Tech.: 28 nm Streaming Multiprocessor Maxwell (SMM) by Taiwan Semiconductor Manufacturing Company Limited - TSMC
RAM: 3584 MB GDDR5-SGRAM + 512 MB GDDR5-SGRAM (4096 MB GDDR5-SGRAM) [Elpida Memory, Inc. W4032BABG-70-F]
RAM-Takt: 1753 MHz (Dual: 3506 MHz / Effective: 7012 MHz)
Width: 224 Bit + 32 Bit (256 Bit)
Bandwith: 196 GB/s + 28,30 GB/s (224,30 GB/s)
Core-Takt: 1033 MHz (NVIDIA Corporation GPU Boost 2.0: 1342 MHz)
Shaders: Shader Model 5.0, Microsoft Corporation DirectX 12.0 (API Feature Level 12.1), Khronos Group Inc. OpenGL 4.5, Khronos Group Inc. OpenCL 1.2, NVIDIA Corporation CUDA 7.5, NVIDIA Corporation DirectCompute 5.0, NVIDIA Corporation PureVideo HD 6 (Video Decode and Presentation API for Unix Feature Set E), Khronos Group Inc. Vulkan 1.0
Shader-Takt: 1033 MHz (NVIDIA Corporation GPU Boost 2.0: 1405 MHz)
Fillrate: 123,80 GTexel/s
Bus: PCI-E 3.0 x16 @ x16 3.0
Anschlüsse: 1x DVI-I, 3x DisplayPort, 1x HDMI, High-Bandwidth SLI 26+26-Pin, PCIe-Power 8+6-Pin
Temperatur: Idle: 25 - 35 °C, Load: 50 - 80 °C
Kühlung: EVGA Corporation Active Cooling Xtreme 2.0+ - ACX 2.0+ (Direct Heat Exhaust) w/ 2x [Power Logic Technology Inc. PLD10015B12H] (100x100x15 mm, DC 12,0 V / 0,55 A / 6,60 W, Double Ball Bearing) + Backplate [100-BP-3973-B9] + EVGA Corporation Digital PWM - Single Digital Voltage Regulator Module w/ 6+2 Digital Phase Power Design
Treiber, Ver.: NVIDIA Corporation GeForce R411.70 WHQL (v10.18.14.1170)
GPU-Z Vers.: TechPowerUp GPU-Z 1.16.0

Sound: Realtek Semiconductor Corp. High Definition Audio Codec (integrated Audio Processing Unit - iAPU)
Signalproz.: ASRock Inc. Purity Sound 3 w/ Digital Theater Systems, Inc. - DTS Connect, Digital Theater Systems, Inc. - DTS Neo:PC, Digital Theater Systems, Inc. - DTS Interactive: Realtek Semiconductor Corp. Avance Logic Codec ALC1150 & Dual Low-Noise Operational Amplifier (VRMS): Texas Instruments Incorporated NE5532 w/ Nichicon Corporation Fine Gold MUSE Acoustic Series
Kanäle: 6x Analog, 1x Digital
Soundmodus: 7.1 Channel Surround
Eingänge: 1x Mic (TRS), 1x AUX (TRS)
Ausgänge: 1x S/PDIF (ODT), 1x Audio 5.1 (TRS)
Abtastfreq.: max. 192 KHz @24 Bit
Boxen: Logitech international S.A. Speaker System Z313
Headset: Sony Mobile Communications, Inc. MDR-NC750, Sony Mobile Communications, Inc. MH750
Features: Sony Mobile Communications, Inc. Xperia XZ Premium [G8141] + Sony Mobile Communications, Inc. Quick Charger UCH12

GehäuseTyp: Desktop
Marke: Thermaltake Technology Co., Ltd. Suppressor F51 Window [CA-1E1-00M1WN-00]
Front: 2x EVGA Corporation RL4Z T1402512M-3M [Globe Electrical Industries - Globe Fan RLXX-Y1402512Z] (140x140x25 mm, 2000 RPM, 153,47 CFM, 39,5 dB(A), DC 12,0 V / 0,30 A / 3,60 W, Sleeve Bearing)
Heck: 1x EVGA Corporation RL4Z T1402512M-3M [Globe Electrical Industries - Globe Fan RLXX-Y1402512Z] (140x140x25 mm, 2000 RPM, 153,47 CFM, 39,5 dB(A), DC 12,0 V / 0,30 A / 3,60 W, Sleeve Bearing)
Oben: 1x Thermaltake Technology Co., Ltd. Pure 20 LED Red [TT-2030] [CL-F032-PL20RE-A] (200x200x30 mm, 800 RPM, 129,639 CFM, 28,2 dB(A), DC 12,0 V / 0,42 A / 5,04 W, Quad Red LEDs, Sleeve Bearing)
Unten: 2x EVGA Corporation RL4Z T1402512M-3M [Globe Electrical Industries - Globe Fan RLXX-Y1402512Z] (140x140x25 mm, 2000 RPM, 153,47 CFM, 39,5 dB(A), DC 12,0 V / 0,30 A / 3,60 W, Sleeve Bearing)
Netzteil: Thermaltake Technology Co., Ltd. German Series Berlin TR2-630AH2NSW [W0393RE] (OEM: Sirtec International Co., Ltd.)
Leistung: 630 Watt
Kühlung: 1x Thermaltake Technology Co., Ltd. [TT-1225A] [Globe Electrical Industries - Globe Fan S1202512L] (120x120x25 mm, 2000 RPM, 67,28 CFM, 34,7 dB(A), DC 12,0 V / 0,18 A / 2,16 W, Sleeve Bearing)
Geräusch: 34,7 dB(A)
WirkGrad: 88% (80+ Bronze): +3,3V = 24A / +5V = 15A / +5Vsb = 3A / +12V = 45A / -12V = 0,3A
so. Features: Casing-fans on reserve: 1x EVGA Corporation RL4Z T1402512M-3M [Globe Electrical Industries - Globe Fan RLXX-Y1402512Z] (140x140x25 mm, 2000 RPM, 153,47 CFM, 39,5 dB(A), DC 12,0 V / 0,30 A / 3,60 W, Sleeve Bearing)
Bauart: Midi-Tower (E-ATX/XL-ATX)

Monitor: Samsung Electronics Co., Ltd. - SEC SyncMaster S24D330H LED
max. Aufl.: 1920 x 1080 @ 60 Hz
Bildfläche: 24" - 531 x 299 mm (Aspect Ratio 16:9) LED
Reaktion: 1 ms
Helligkeit: 250 cd/qm
Kontrast: 1000:1
Anschlüsse: 1x VGA D-Sub (DE-15), 1x HDMI
Leistung: 25 Watt (Energy Star 6.0)
CD / DVD: Lite-On Technology Corporation iHAS124-19 B
Router: Audio Visuelles Marketing Computersysteme Vertriebs GmbH - AVM FRITZ!Box 6490 Cable

Lenkrad: Logitech international S.A. G29 Driving Force
Keyboard: Logitech international S.A. G15 Gaming
Maus: Logitech international S.A. Mouse M100
Joystick: Mad Catz Interactive Inc. - Saitek Ltd. Cyborg V.1 Flight Stick
 
     



     
 

Laufwerk: Samsung Electronics Co., Ltd. - SEC SSD 850 EVO MZ-75E500B/EU
Beschreib.: 512 MB 933 MHz (1866 MHz) DDR3L-SDRAM / LPDDR3-1866 (PC3L-14900S) [Samsung Electronics Co., Ltd. - SEC MGX S4LN062X01-Y030]
Kapazität: 500 GB (Samsung Electronics Co., Ltd. - SEC Toggle DDR 2.0 TLC V-NAND [Samsung Electronics Co., Ltd. - SEC K90MGY8S7M])
Interface: SATA-600 | 6 Gb/s (ACS-2)
DataSpeed: 550 MB/s | 500 MB/s
AccessTime: 4KB-Q32T1: 95810 IOPS | 88400 IOPS
Temperatur: 25 - 45 °C (Samsung Electronics Co., Ltd. - SEC Dynamic Thermal Guard Protection: 70 °C)
Anschluss: SATA-600 | 6 Gb/s


Laufwerk: Seagate Technology plc Barracuda 7200.12 ST2000DM001-1ER164
Beschreib.: 64 MB Cache
Kapazität: 2000 GB (Platters: 2x 1000 GB | Actuators: 2x | Disk read/write heads: 4x)
Umdrehung.: 7200 Upm
Interface: SATA-600 | 6 Gb/s (ATA-8 - ACS/ATA-8 - ACS-2)
Temperatur: 30 - 35 °C
Anschluss: SATA-600 | 6 Gb/s


Laufwerk: Lite-On Technology Corporation iHAS124-19 B
Beschreib.: 0,8 MB Cache, DVD-ROM 16x, DVD-RAM 6x, DVD-R 24x, DVD+R 24x, DVD-R DL 8x, DVD+R DL 8x, DVD-RW 6x, DVD+RW 8x, CD-ROM 48x, CD-R 48x, CD-RW 24x
Interface: SATA-150 | 1,5 Gb/s (ATA-8 - ACS)
AccessTime: 200 ms
Anschluss: SATA-600 | 6 Gb/s


 
     



     
 

Betriebssystem: Microsoft Corporation Windows 10 Pro x64
Display: 1920 x 1080 @ 60, True Color 32 Bit
 
     



     
 

Anschluss: EuroDOCSIS 3.0 (Data Over Cable Service Interface Specification)
DownStream: 400000 Kbps
UpStream: 25000 Kbps
Zugang: Audio Visuelles Marketing Computersysteme Vertriebs GmbH - AVM FRITZ!Box 6490 Cable

Provider: Vodafone Kabel Deutschland GmbH
Tarif: Red Internet & Phone 400 Cable inklusive WLAN-Hotspot + GigaTV inklusive HD Premium Plus Cable
Kosten: 69,89 €

 
     



     
 

Prozessor: Integrated Electronics Corporation - Intel Core i7-6700K

Grafikkarte: NVIDIA Corporation GeForce GTX 970

Auflösung: 1920 x 1080 @ 60, True Color 32 Bit

Mainboard: ASRock Inc. Z170 Extreme4 (w/o ASRock Inc./Hon Hai Precision Industry Co., Ltd. - Foxconn Electronics Inc. USB 3.1 Front Panel) (equal: ASRock Inc. Z170 Extreme4+ w/ ASRock Inc./Hon Hai Precision Industry Co., Ltd. - Foxconn Electronics Inc. USB 3.1 Front Panel)

Treiber: NVIDIA Corporation GeForce R411.70 WHQL (v10.18.14.1170)

OS: Microsoft Corporation Windows 10 Pro x64

 
     



     
 

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