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lucky1levinlucky1levin
Willkommen im sysProfile nr: 187517
| Profil geändert: |
04.08.2020, 12:35 |
| Profil erstellt: |
30.01.2015, 11:17 |
| Anzahl Views: |
3103 |
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lucky1levin's System is powered by...                                
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Preis/Leistung
50%
Silence
100%
RechenPower
75%
GamingPower
100%
Cooles Design
100%
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G.Skill Trident Z RGB F4-3866C18D-16GTZR |
G.Skill Trident Z RGB F4-3866C18D-16GTZR |
G.Skill Trident Z RGB F4-3866C18D-16GTZR |
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G.Skill Trident Z RGB F4-3866C18D-16GTZR |
Intel Core i7-7800X |
ASUS Prime X299-A |
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G.Skill Trident Z RGB F4-3866C18D-16GTZR |
G.Skill Trident Z RGB F4-3866C18D-16GTZR |
![EVGA GeForce GTX 1070 FTW GAMING ACX 3.0 [08G-P4-6276-KR]](http://pic.sysprofile.de/images/tn_Zbv26282.jpg)
EVGA GeForce GTX 1070 FTW GAMING ACX 3.0 [08G-P4-6276-KR] |
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Prozessor: |
Integrated Electronics Corporation - Intel Core i7-7800X |
Sonstige Features:
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| Codename: | Skylake-X "Sky Bay-SP" (Integrated Electronics Corporation - Intel Skylake Microarchitecture) | | Architekt.: | Six-Core Processor | | Revision: | H2 | | Tech.: | Integrated Electronics Corporation - Intel 3D Tri-Gate Transistor Technology: 14+ nm Fin Field-Effect Transistor - FinFET (14FF+) | | F.M.S.: | Integrated Electronics Corporation - Intel Core Gen7 | | Instruct.: | Integrated Electronics Corporation - Intel Extended Multi Media Extension (MMX(+)), Integrated Electronics Corporation - Intel Advanced Encryption Standard - New Instructions (AES-NI), Integrated Electronics Corporation - Intel Carry-Less Multiplication (CLMUL), International Business Machines Corporation - IBM Research Fused Multiply-Add (FMA), International Business Machines Corporation - IBM Research Fused Multiply-Add 3 (FMA3), Integrated Electronics Corporation - Intel Extended Memory 64 Technology (EM64T/Intel 64), Integrated Electronics Corporation - Intel Streaming Single Instruction Multiple Data (SIMD) Extensions (SSE), Integrated Electronics Corporation - Intel Streaming Single Instruction Multiple Data (SIMD) Extensions 2 (SSE2), Integrated Electronics Corporation - Intel Streaming Single Instruction Multiple Data (SIMD) Extensions 3 (SSE3), Integrated Electronics Corporation - Intel Supplemental Streaming Single Instruction Multiple Data (SIMD) Extensions 3 (SSSE3), Integrated Electronics Corporation - Intel Supplemental Streaming Single Instruction Multiple Data (SIMD) Extensions 4 (SSE4/SSE4.1/SSE4.2), Integrated Electronics Corporation - Intel Advanced Vector Extensions (AVX), Integrated Electronics Corporation - Intel Advanced Vector Extensions 2.0 (AVX2), Integrated Electronics Corporation - Intel Advanced Vector Extensions 512 (AVX-512), Integrated Electronics Corporation - Intel Trusted Execution Technology (TXT), Integrated Electronics Corporation - Intel Transactional Synchronization Extensions - New Instructions (TSX−NI), Integrated Electronics Corporation - Intel Software Guard Extensions (SGX), Integrated Electronics Corporation - Intel No eXecute Bit (NX-Bit), Integrated Electronics Corporation - Intel eXecute Disable Bit (XD-Bit), Integrated Electronics Corporation - Intel Bit Manipulation Instructions Sets (BMI), Integrated Electronics Corporation - Intel CVT16 (F16C), Integrated Electronics Corporation - Intel Active Management Technology 2.0 (iAMT2), Integrated Electronics Corporation - Intel Virtualization Technology (VT/VT-x), Integrated Electronics Corporation - Intel Virtualization Technology for Directed I/O (VT-d/Vi), Integrated Electronics Corporation - Intel Turbo Boost Technology 2.0, Integrated Electronics Corporation - Intel Hyper-Threading Technology; Parallel Architectures and Compilation Techniques (PACT); Integrated Electronics Corporation - Intel Core to Core Communication Acceleration Framework (CAF); Integrated Electronics Corporation - Intel Core to Core Communication Paradigm (CP): Thread-Level Parallelism & Instruction-Level Parallelism, Integrated Electronics Corporation - Intel Speed Shift Technology, Integrated Electronics Corporation - Intel Active Management Technology, Enhanced Integrated Electronics Corporation - Intel SpeedStep Technology, Core-based and Package-based State, Auto Halt (C1), Enhanced Halt State (C1E), Stop Clock/Stop Grant (C2), Extended Stop Grant State (C2E), Deep Sleep (C3), Deep Sleep State (C3E), Deeper Sleep (C4), Enhanced Deeper Sleep (C4E/C5), Deep Power Down (C6), Deeper Power Down (C7) | | Socket: | R4 (FCLGA-2066: Flip-Chip Land Grid Array) | | CPU-Takt: | Core State: 1200 ~ 3500 MHz (Integrated Electronics Corporation - Intel Turbo Boost Technology 2.0: 4000 MHz) | | Multiplik.: | Integrated Electronics Corporation - Intel Mesh-of-Trees Interconnect: 12x ~ 35x (Integrated Electronics Corporation - Intel Turbo Boost Technology 2.0: 40x) / Integrated Electronics Corporation - Intel Omni-Path Interconnect: 35x (Integrated Electronics Corporation - Intel Turbo Boost Technology 2.0: 40x) | | FSB: | Integrated Electronics Corporation - Intel Mesh-of-Trees Interconnect: 100 MHz / Integrated Electronics Corporation - Intel Omni-Path Interconnect: 100 MHz | | L1 Cache: | 6x 32 KBytes Instruction Cache, 6x 32 KBytes Data Cache | | L2 Cache: | 6x 1024 KBytes | | L3 Cache: | 8448 KBytes | | Voltage: | Core State: 0,693 ~ 0,963 V (Integrated Electronics Corporation - Intel Turbo Boost Technology 2.0: 1,151 V) | | Besonderh.: | Integrated Electronics Corporation - Intel Next-Generation Polymer Thermal Interface Material - NGPTIM, Integrated Electronics Corporation - Intel Fully Integrated Voltage Regulator - FIVR, Integrated Memory Controller w/ Memory Management Unit, Unlocked Delay-Locked Loop & Unlocked Phase-Locked Loop (Variable CPU Multiplier), Integrated Electronics Corporation - Intel Power Control Unit | | Overclocked: | Core State #47: 4700 MHz (47x 100 MHz) @ 1,200 V | | Kühlung: | RASCOM Computerdistribution Ges.m.b.H. & Kolink International Corporation - Noctua NH-D15 + 3x RASCOM Computerdistribution Ges.m.b.H. & Kolink International Corporation - Noctua NF-A15 PWM (140x140x25 mm, 1500 RPM, 82,50 CFM, 24,6 dB(A), DC 12,0 V / 0,13 A / 1,56 W, Self-Stabilising Oil-Pressure Bearing 2) | | Temperatur: | Idle: 20 - 30 °C, Load: 45 - 100 °C w/ Thermal Interface Material: GELID Solutions Ltd. GC-Extreme & Prolimatech Inc. PK-3 Nano & Arctic Silver Inc. Céramique 2 (Tjunction @ Tcase (Integrated Electronics Corporation - Intel Platform Environment Control Interface) & Tcore (Integrated Electronics Corporation - Intel Digital Thermal Sensors)) | | CPU-Z Vers.: | CPUID CPU-Z 1.78.1
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MainBoard: |
ASUSTeK Computer Inc. - ASUS Prime X299-A [90MB0U40-M0EAY0] |
| Chipsatz: | Integrated Electronics Corporation - Intel X299 | | Northbridge: | Integrated Electronics Corporation - Intel Xeon (Skylake-E) M2PCI Registers (I/O Memory Management Unit) Memory Controller Hub Revision 00 + ASUSTeK Computer Inc. - ASUS DIGI+ VRM - Hybrid Digital Voltage Regulator Module w/ 8+2 Digital Phase Power Design (VCCIA 8+0/7+1/6+2 Dual-Output Digital Multi-Phase Dual-Loop PWM Controller w/ PowIRCenter GUI: Infineon Technologies AG - International Rectifier Corporation IR35201M (ASUSTeK Computer Inc. - ASUS DIGI+ VRM Energy Processing Unit: ASUSTeK Computer Inc. - ASUS ASP1405I) w/ 60A Integrated PowIRstage Synchronous Buck Gate Driver: Infineon Technologies AG - International Rectifier Corporation IR3555M w/ Panasonic Semiconductor Solutions Co., Ltd. - Panasonic Corporation MIL 10K Solid Caps w/ ASUSTeK Computer Inc. - ASUS 60A Chokes; VCCIO & VCCSA 8+0/7+1/6+2 Dual-Output Digital Multi-Phase Dual-Loop PWM Controller w/ PowIRCenter GUI: Infineon Technologies AG - International Rectifier Corporation IR35201M (ASUSTeK Computer Inc. - ASUS DIGI+ VRM Energy Processing Unit: ASUSTeK Computer Inc. - ASUS ASP1405I) w/ Multi-Phase Synchronous Buck NexFET Power Stage Converter & Gate Driver: Texas Instruments Incorporated CSD97374Q4M w/ Panasonic Semiconductor Solutions Co., Ltd. - Panasonic Corporation MIL 10K Solid Caps w/ ASUSTeK Computer Inc. - ASUS 60A Chokes; VDDQ & VDDP ASUSTeK Computer Inc. - ASUS DIGI+ VRM Energy Processing Unit: ASUSTeK Computer Inc. - ASUS ASP1103 w/ Panasonic Semiconductor Solutions Co., Ltd. - Panasonic Corporation MIL 10K Solid Caps w/ ASUSTeK Computer Inc. - ASUS 60A Chokes) | | Southbridge: | Integrated Electronics Corporation - Intel Union Point-H (Basin Falls) GL82X299 Platform Controller Hub Revision 00 (Lithograph: 22 nm) & 2M-Bit Serial NOR Flash Memory for CMOS-SRAM/ -EEPROM w/ Dual I/O SPI: Winbond Electronics Corporation SpiFlash W25X20CLNIG & 16-to-8 Channel Multiplexer/Demultiplexer Switch w/ Hi-Z Outputs for PCI-Express High Bandwidth Bi-Directional Differential Protocols: ASMedia Technology Inc. ASM1480 & USB 3.1 Gen2 eXtensible Host Controller Interface & PCIe PHY: ASMedia Technology Inc. ASM3142 & USB 3.1 Type-C High Speed Digital Switch w/ Integrated CC Logic: ASMedia Technology Inc. ASM1543 & Thunderbolt 3 Controller: Integrated Electronics Corporation - Intel DSL6540 USB Type-C & USB PD Controller w/ Power Switch & High-Speed Multiplexer: Texas Instruments Incorporated TPS65982 | | Revision: | Revision 1.xx | | BiosVersion: | American Megatrends Inc. - AMI Unified Extensible Firmware Interface - UEFI 5.0 / 1401 (System Management Basic Input/Output System - SMBIOS 3.0, Advanced Configuration and Power Interface - ACPI 6.0, Integrated Electronics Corporation - Intel Management Engine Interface, Integrated Electronics Corporation - Intel Real-time Accelerated Processing of I/O Data - Rapid Storage Technology, Integrated Electronics Corporation - Intel Direct Media Interface 3.0, Integrated Electronics Corporation - Intel Turbo Boost Technology 2.0, Integrated Electronics Corporation - Intel Turbo Boost Max Technology 3.0, NVIDIA Corporation SLI Technology, Advanced Micro Devices, Inc. - AMD CrossFireX Technology, ASUSTeK Computer Inc. - ASUS MultiCore Enhancement, ASUSTeK Computer Inc. - ASUS Dual Intelligent Processors 5 Technology, ASUSTeK Computer Inc. - ASUS DIGI+ Power Control, ASUSTeK Computer Inc. - ASUS PRO Clock II Technology (Phase-Locked Loop: ASUSTeK Computer Inc. - ASUS TurboV Processing Unit), ASUSTeK Computer Inc. - ASUS Q-Design, ASUSTeK Computer Inc. - ASUS EZ DIY, ASUSTeK Computer Inc. - ASUS AURA Sync, ASUSTeK Computer Inc. - ASUS AI Suite 3 w/ ASUSTeK Computer Inc. - ASUS Fan Xpert 4) | | Anschlüsse: | 2x PCIe 3.0 x16 single @ x16 mode - dual @ x16 mode, 1x PCIe 3.0 x16 @ x8 mode, 2x PCIe 3.0 x4 @ x4 mode, 1x PCIe 3.0 x1, 8x SATA3, 2x M.2 (NGFF), 1x USB 3.1 Gen2 LPC, 2x USB 3.1 Gen1 LPC, 1x USB 2.0 LPC, 7x PWM/DC LPCIO, 1x Thunderbolt AIC LPC, EATXPWR 24-Pin, EATX12V 8+4-Pin, 1x MemOK! Button, 1x Power Button, 1x Dr. Debug w/ LED | | extern: | 2x USB 2.0 Type-A, 1x USB 3.1 Gen2 Type-C, 1x USB 3.1 Gen2 Type-A, 4x USB 3.1 Gen1 Type-A, 1x LAN (RJ-45), 1x ODT (F05), 1x Audio 5.1 (TRS), 1x USB BIOS Flashback Button | | Temperatur: | Idle: 30 - 35 °C, Load: 35 - 45 °C | | Kühlung: | ASUSTeK Computer Inc. - ASUS Ultra-efficient Heatsinks + Low Pin Count Super Input/Output Interface - LPCIO w/ Active Thermal Control - ATC: Nuvoton Technology Corp. NCT6796D + PWM/DC Hardware Monitoring IC w/ PECI 3.0 Interface & Multifunctional GPIO & Smart Fan IV Mode: Nuvoton Technology Corp. NCT7802Y
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RAM: |
G.Skill International Enterprise Co., Ltd. Trident Z RGB F4-3866C18D-16GTZR / G.Skill International Enterprise Co., Ltd. Trident Z RGB F4-3866C18D-16GTZR |
| Size: | 2x 8192 MB (16384 MB) / 2x 8192 MB (16384 MB) | | Typ: | DDR4-SDRAM (PC4-30900U) [Samsung Semiconductor, Inc. - Samsung Electronics Co., Ltd. - SEC 637 K4A8G085WB-BCPB] / DDR4-SDRAM (PC4-30900U) [Samsung Semiconductor, Inc. - Samsung Electronics Co., Ltd. - SEC 637 K4A8G085WB-BCPB] | | Timing: | Nominal: 18-19-19-39-58-2N (CL-RCD-RP-RAS-RC-CR) | Quad Channel: 18-19-19-39-58-2N (CL-RCD-RP-RAS-RC-CR) | Quad Channel: 15-16-15-35-50-1N (CL-RCD-RP-RAS-RC-CR) | Dual Channel: 18-19-19-39-58-2N (CL-RCD-RP-RAS-RC-CR) | Dual Channel: 15-16-15-35-50-1N (CL-RCD-RP-RAS-RC-CR) | | RAM-Takt: | Nominal: 1933 MHz (3866 MHz) | Quad Channel: 1900 MHz (3800 MHz) | Quad Channel: 1600 MHz (3200 MHz) | Dual Channel: 1900 MHz (3800 MHz) | Dual Channel: 1600 MHz (3200 MHz) | | DataSpeed: | Quad Channel: 76,710 GB/s / 93,490 GB/s / 66,725 GB/s | Quad Channel: 71,705 GB/s / 84,700 GB/s / 64,830 GB/s | Dual Channel: 53,660 GB/s / 52,840 GB/s / 46,225 GB/s | Dual Channel: 45,885 GB/s / 44,830 GB/s / 40,465 GB/s | | AccessTime: | Quad Channel: 66 ns | Quad Channel: 70 ns | Dual Channel: 64 ns | Dual Channel: 66 ns | | Voltage: | Nominal: 1,35 V | Quad Channel: 1,40 V | Quad Channel: 1,40 V | Dual Channel: 1,35 V | Dual Channel: 1,35 V | | Ratio: | Nominal: 29x @133 MHz (FSB:DRAM Ratio) | Quad Channel: 38x @100 MHz (FSB:DRAM Ratio) | Quad Channel: 24x @133 MHz (FSB:DRAM Ratio) | Dual Channel: 38x @100 MHz (FSB:DRAM Ratio) | Dual Channel: 24x @133 MHz (FSB:DRAM Ratio) | | Temperatur: | Idle: 35 - 40 °C, Load: 40 - 50 °C / Idle: 35 - 40 °C, Load: 40 - 50 °C
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Grafikkarte: |
NVIDIA Corporation GeForce GTX 1070 / NVIDIA Corporation GeForce GTX 1070 |
| Subvendor: | EVGA Corporation GeForce GTX 1070 FTW GAMING ACX 3.0 [08G-P4-6276-KR] / EVGA Corporation GeForce GTX 1070 FTW GAMING ACX 3.0 [08G-P4-6276-KR] | | Chipsatz: | GP104-200-A1 (NVIDIA Corporation Pascal Microarchitecture) / GP104-200-A1 (NVIDIA Corporation Pascal Microarchitecture) | | Tech.: | 16 nm FinFET Streaming Multiprocessor Pascal (SMP) by Taiwan Semiconductor Manufacturing Company Limited - TSMC / 16 nm FinFET Streaming Multiprocessor Pascal (SMP) by Taiwan Semiconductor Manufacturing Company Limited - TSMC | | RAM: | 8192 MB GDDR5-SGRAM [Micron Technology Inc. MT51J256M32HF-80:A - 6WA47-D9TCB] / 8192 MB GDDR5-SGRAM [Micron Technology Inc. MT51J256M32HF-80:A - 6WA47-D9TCB] | | RAM-Takt: | 2002 MHz (Dual: 4004 MHz / Effective: 8008 MHz) / 2002 MHz (Dual: 4004 MHz / Effective: 8008 MHz) | | Width: | 256 Bit / 256 Bit | | Bandwith: | 256,30 GB/s / 256,30 GB/s | | Core-Takt: | 1607 MHz (NVIDIA Corporation GPU Boost 3.0: 1797 MHz) / 1607 MHz (NVIDIA Corporation GPU Boost 3.0: 1797 MHz) | | Shaders: | Shader Model 5.0, Microsoft Corporation DirectX 12.0 (API Feature Level 12.1), Khronos Group Inc. OpenGL 4.5, Khronos Group Inc. OpenCL 1.2, NVIDIA Corporation CUDA 8.0, NVIDIA Corporation DirectCompute 5.0, NVIDIA Corporation PureVideo HD 8 (Video Decode and Presentation API for Unix Feature Set H), Khronos Group Inc. Vulkan 1.0 / Shader Model 5.0, Microsoft Corporation DirectX 12.0 (API Feature Level 12.1), Khronos Group Inc. OpenGL 4.5, Khronos Group Inc. OpenCL 1.2, NVIDIA Corporation CUDA 8.0, NVIDIA Corporation DirectCompute 5.0, NVIDIA Corporation PureVideo HD 8 (Video Decode and Presentation API for Unix Feature Set H), Khronos Group Inc. Vulkan 1.0 | | Shader-Takt: | 1607 MHz (NVIDIA Corporation GPU Boost 3.0: 1797 MHz) /1607 MHz (NVIDIA Corporation GPU Boost 3.0: 1797 MHz) | | Fillrate: | 192,8 GTexel/s / 192,8 GTexel/s | | Bus: | PCI-E 3.0 x16 @ x16 3.0 / PCI-E 3.0 x16 @ x16 3.0 | | Anschlüsse: | 1x DVI-D Dual-Link, 3x DisplayPort 1.4, 1x HDMI 2.0b, High-Bandwidth SLI 26+26-Pin, PCIe-Power 8+8-Pin / 1x DVI-D Dual-Link, 3x DisplayPort 1.4, 1x HDMI 2.0b, High-Bandwidth SLI 26+26-Pin, PCIe-Power 8+8-Pin | | Temperatur: | Idle: 25 - 35 °C, Load: 50 - 85 °C / Idle: 25 - 35 °C, Load: 50 - 85 °C | | Kühlung: | EVGA Corporation Active Cooling Xtreme 3.0 - ACX 3.0 w/ 2x [Power Logic Technology Inc. PLD10015B12H] (100x100x15 mm, 3250 RPM, DC 12,0 V / 0,55 A / 6,60 W, Double Ball Bearing) + EVGA Corporation Digital PWM - Hybrid Digital Voltage Regulator Module w/ 10+2 Digital Phase Power Design (VDDC 5+0 Multi-Phase Synchronous Buck PWM Controller: ON Semiconductor Corporation NPC81274 w/ Integrated Driver & MOSFET: ON Semiconductor Corporation NCP81382; VDDC Current Balancing Multi-Phase Doubler w/ Gate Driver & Power Driver: ON Semiconductor Corporation NCP81162; VDDQ 2-Phase Synchronous Buck PWM Controller w/ Integrated Gate Drivers & PWM VID Interface: ON Semiconductor Corporation NPC81278 w/ ON Semiconductor Corporation NTMFD4C85N; Power Monitor: Texas Instruments Incorporated INA3221) / EVGA Corporation Active Cooling Xtreme 3.0 - ACX 3.0 w/ 2x [Power Logic Technology Inc. PLD10015B12H] (100x100x15 mm, 3250 RPM, DC 12,0 V / 0,55 A / 6,60 W, Double Ball Bearing) + EVGA Corporation Digital PWM - Hybrid Digital Voltage Regulator Module w/ 10+2 Digital Phase Power Design (VDDC 5+0 Multi-Phase Synchronous Buck PWM Controller: ON Semiconductor Corporation NPC81274 w/ Integrated Driver & MOSFET: ON Semiconductor Corporation NCP81382; VDDC Current Balancing Multi-Phase Doubler w/ Gate Driver & Power Driver: ON Semiconductor Corporation NCP81162; VDDQ 2-Phase Synchronous Buck PWM Controller w/ Integrated Gate Drivers & PWM VID Interface: ON Semiconductor Corporation NPC81278 w/ ON Semiconductor Corporation NTMFD4C85N; Power Monitor: Texas Instruments Incorporated INA3221) | | Treiber, Ver.: | NVIDIA Corporation GeForce R411.70 WHQL (v10.18.14.1170) / NVIDIA Corporation GeForce R411.70 WHQL (v10.18.14.1170) | | GPU-Z Vers.: | TechPowerUp GPU-Z 1.16.0
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Sound: |
Realtek Semiconductor Corp. High Definition Audio Codec (integrated Audio Processing Unit - iAPU) |
| Signalproz.: | ASUSTeK Computer Inc. - ASUS Crystal Sound 3 w/ Digital Theater Systems, Inc. - DTS Coherent Acoustics (DCA) - DTS Connect, Digital Theater Systems, Inc. - DTS Coherent Acoustics (DCA) - DTS Neo:PC, Digital Theater Systems, Inc. - DTS Coherent Acoustics (DCA) - DTS Interactive, Digital Theater Systems, Inc. - DTS Coherent Acoustics (DCA) - DTS Headphone:X: Realtek Semiconductor Corp. Avance Logic Codec ALC1220 (ASUSTeK Computer Inc. - ASUS SupremeFX S1220A w/ integrated Operational Amplifier (iVRMS)) w/ Nichicon Corporation Fine Gold MUSE Acoustic Series | | Kanäle: | 6x Analog, 1x Digital | | Soundmodus: | 7.1 Channel Surround | | Eingänge: | 1x Mic (TRS), 1x AUX (TRS) | | Ausgänge: | 1x S/PDIF (ODT), 1x Audio 5.1 (TRS) | | Abtastfreq.: | max. 192 KHz @24 Bit | | Boxen: | Audiovox Corporation - Magnat Audio-Produkte GmbH Monitor 880 [Paar], Audio Products International Corp. - Mirage AVS-500 B-1 (Audio Products International Corp. - Mirage AVS-100, Audio Products International Corp. - Mirage AVS-200 [Paar], Audio Products International Corp. - Mirage FRx-S8) | | Headset: | Samsung Electronics Co., Ltd. - SEC EO-EG920BW, Samsung Electronics Co., Ltd. - SEC EO-EG900BW [Samsung Electronics Co., Ltd. - SEC EO-HS3303WE], Samsung Electronics Co., Ltd. - SEC EO-IG955BSEGWW Titanium Gray (Tuned by AKG Acoustics GmbH) | | Features: | Matsushita Electric Industrial Co. Ltd. - Panasonic Corporation SA-XR58 EG-K, Nippon Columbia Co., Ltd. - Denon UDRA-M7, Samsung Electronics Co., Ltd. - SEC Galaxy S7 Edge [SM-G935F]
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GehäuseTyp: |
Desktop |
| Marke: | EVGA Corporation DG-87 Gaming Case [100-E1-1236-K0] | | Front: | 2x RASCOM Computerdistribution Ges.m.b.H. & Kolink International Corporation - Noctua NF-A14 PWM (140x140x25 mm, 1500 RPM, 82,50 CFM, 24,6 dB(A), DC 12,0 V / 0,13 A / 1,56 W, Self-Stabilising Oil-Pressure Bearing 2) | | Heck: | 4x RASCOM Computerdistribution Ges.m.b.H. & Kolink International Corporation - Noctua NF-A14 PWM (140x140x25 mm, 1500 RPM, 82,50 CFM, 24,6 dB(A), DC 12,0 V / 0,13 A / 1,56 W, Self-Stabilising Oil-Pressure Bearing 2) | | Seite: | 3x RASCOM Computerdistribution Ges.m.b.H. & Kolink International Corporation - Noctua NF-A20 PWM (200x200x30 mm, 800 RPM, 86,50 CFM, 18,1 dB(A), DC 12,0 V / 0,08 A / 0,96 W, Self-Stabilising Oil-Pressure Bearing 2) + 1x RASCOM Computerdistribution Ges.m.b.H. & Kolink International Corporation - Noctua NF-A20 FLX (200x200x30 mm, 800 RPM, 86,50 CFM, 18,1 dB(A), DC 12,0 V / 0,08 A / 0,96 W, Self-Stabilising Oil-Pressure Bearing 2) | | Oben: | 2x RASCOM Computerdistribution Ges.m.b.H. & Kolink International Corporation - Noctua NF-A14 PWM (140x140x25 mm, 1500 RPM, 82,50 CFM, 24,6 dB(A), DC 12,0 V / 0,13 A / 1,56 W, Self-Stabilising Oil-Pressure Bearing 2) | | Netzteil: | EVGA Corporation SuperNOVA 850 T2 Power Supply [220-T2-0850-X2] (OEM: Super Flower Computer Inc.) | | Leistung: | 850 Watt | | Kühlung: | 1x Globe Electrical Industries - Globe Fan RL4Z B1402512M (140x140x25 mm, 1200 RPM, 92,16 CFM, 24,9 dB(A), DC 12,0 V / 0,30 A / 3,60 W, Double Ball Bearing) & ECO Intelligent Thermal Control (ECO ITC) w/ Ultra Quiet Fan System (Zero Fan Noise < 45 °C) | | Geräusch: | 18 dB(A) | | WirkGrad: | 94% (80+ Titanium): +3,3V = 20A / +5V = 20A / +5Vsb = 2,5A / +12V = 70,8A / -12V = 0,5A | | so. Features: | Accessories for connections: 12x RASCOM Computerdistribution Ges.m.b.H. & Kolink International Corporation - Noctua NA-SEC1 Extension Cables + 14x RASCOM Computerdistribution Ges.m.b.H. & Kolink International Corporation - Noctua NA-SRC7 Low-Noise Adaptors + 12x RASCOM Computerdistribution Ges.m.b.H. & Kolink International Corporation - Noctua NA-SYC1 Y-Cables / Accessories for cases: 2x PC-Cooling GmbH - Nanoxia LED Rigid Bar RGB [NRLED30RGB] | | Bauart: | Big-Tower (HPTX/E-ATX/XL-ATX)
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Monitor: |
Samsung Electronics Co., Ltd. SyncMaster U28E850R LED [LU28E85KRS/EN] |
| max. Aufl.: | 3840 x 2160 @ 60 Hz @ 12 Bit (8 Bit w/ Frame Rate Control (FRC)) @ 157 ppi | | Bildfläche: | 28" - 623 x 345 mm (Aspect Ratio 16:9) Twisted Nematic Liquid Crystal Display (TN-LCD) w/ White Light Emitting Diode Backlight (Direct WLED) [Innolux Corporation M280DGJ-L30] | | Reaktion: | 1 ms | | Helligkeit: | 370 cd/qm | | Kontrast: | Native Contrast Ratio (NCR): 1.000:1 & Dynamic Contrast Ratio (DCR): 100.000.000:1 | | Anschlüsse: | 1x HDMI 2.0, 1x HDMI 1.4, 2x DisplayPort 1.2 | | Leistung: | 39 Watt (Energy Star 7.0) |
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Router: |
Audio Visuelles Marketing Computersysteme Vertriebs GmbH - AVM FRITZ!Box 6490 Cable |
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Keyboard: |
Esperanza Sp. J. Poterek NZA KESTREL EGK504-T USB Gaming Keyboard |
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Maus: |
Logitech international S.A. G502 Proteus Spectrum Tunable RGB-Gaming-Maus (910-004617) |
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Gamepad: |
Microsoft Corporation Xbox 360 Wireless Controller for Windows |
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Gamepad: |
Microsoft Corporation Xbox 360 Wireless Controller for Windows |
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Gamepad: |
Microsoft Corporation Xbox 360 Wireless Controller for Windows |
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Gamepad: |
Microsoft Corporation Xbox 360 Wireless Controller for Windows |
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Sonstiges: |
Microsoft Corporation Xbox 360 Wireless Gaming Receiver for Windows |
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Lenkrad: |
Guillemot Corporation - Thrustmaster T500 RS |
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Laufwerk: |
Samsung Electronics Co., Ltd. - SEC SSD 850 EVO MZ-75E500B/EU |
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Beschreib.:
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512 MB 933 MHz (1866 MHz) DDR3L-SDRAM / LPDDR3-1866 (PC3L-14900S) Samsung Electronics Co., Ltd. - SEC 528 K4E8E16-4EBSGCF & Samsung Electronics Co., Ltd. - SEC MGX S4LN062X01-Y030 w/ Advanced RISC Machines Ltd. - ARM Limited Cortex R4 (Advanced RISC Machines Ltd. - ARM Limited ARMv7 NEON Architecture
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Kapazität:
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500 GB (Samsung Electronics Co., Ltd. - SEC Toggle DDR 2.0 TLC V-NAND [Samsung Electronics Co., Ltd. - SEC 546 K90MGY8S7M-CCK0])
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Interface:
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SATA-600 (6 Gb/s) | AHCI (ACS-2)
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DataSpeed:
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550 MB/s | 500 MB/s
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AccessTime:
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4KB-Q32T1: 95810 IOPS | 88400 IOPS
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Temperatur:
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25 - 45 °C (Samsung Electronics Co., Ltd. - SEC Dynamic Thermal Guard Protection: 70 °C)
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Anschluss:
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SATA-600 (6 Gb/s) | AHCI
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Laufwerk: |
Samsung Electronics Co., Ltd. - SEC SSD 850 EVO MZ-75E500B/EU |
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Beschreib.:
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512 MB 933 MHz (1866 MHz) DDR3L-SDRAM / LPDDR3-1866 (PC3L-14900S) Samsung Electronics Co., Ltd. - SEC 528 K4E8E16-4EBSGCF & Samsung Electronics Co., Ltd. - SEC MGX S4LN062X01-Y030 w/ Advanced RISC Machines Ltd. - ARM Limited Cortex R4 (Advanced RISC Machines Ltd. - ARM Limited ARMv7 NEON Architecture
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Kapazität:
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500 GB (Samsung Electronics Co., Ltd. - SEC Toggle DDR 2.0 TLC V-NAND [Samsung Electronics Co., Ltd. - SEC 546 K90MGY8S7M-CCK0])
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Interface:
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SATA-600 (6 Gb/s) | AHCI (ACS-2)
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DataSpeed:
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550 MB/s | 500 MB/s
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AccessTime:
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4KB-Q32T1: 95810 IOPS | 88400 IOPS
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Temperatur:
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25 - 45 °C (Samsung Electronics Co., Ltd. - SEC Dynamic Thermal Guard Protection: 70 °C)
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Anschluss:
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SATA-600 (6 Gb/s) | AHCI
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Laufwerk: |
Samsung Electronics Co., Ltd. - SEC SSD 970 EVO MZ-V7E1T0BW |
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Beschreib.:
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1024 MB 1200 MHz (2400 MHz) DDR4L-SDRAM / LPDDR4-2400 (PC4L-19200U) Samsung Electronics Co., Ltd. - SEC 746 K4F6E3S-4HMBGCH & Samsung Electronics Co., Ltd. - SEC Phoenix S4LR020-S6KDWMMP5 w/ Advanced RISC Machines Ltd. - ARM Limited Cortex R5 (Advanced RISC Machines Ltd. - ARM Limited ARMv7 NEON Architecture
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Kapazität:
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1000 GB (Samsung Electronics Co., Ltd. - SEC Toggle DDR 2.0 TLC V-NAND v4 [Samsung Electronics Co., Ltd. - SEC 807 K90VGY8J5M-DCK0])
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Interface:
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PCIe 3.0 x4 (32 Gb/s) | NVMe 1.3
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Temperatur:
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40 - 45 °C (Samsung Electronics Co., Ltd. - SEC Dynamic Thermal Guard Protection: 70 °C)
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Anschluss:
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NGFF M | M.2-2280
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Betriebssystem: |
Microsoft Corporation Windows 10 Pro x64 |
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Display:
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3840 x 2160 @ 60 Hz, Deep Color 30 Bit
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Anschluss: |
EuroDOCSIS 3.0 (Data Over Cable Service Interface Specification) |
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DownStream:
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 400000 Kbps
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UpStream:
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25000 Kbps
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Ping:
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15 ms
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Zugang:
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Audio Visuelles Marketing Computersysteme Vertriebs GmbH - AVM FRITZ!Box 6490 Cable
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Provider:
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Vodafone Kabel Deutschland GmbH
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Tarif:
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Red Internet & Phone 400 Cable inklusive WLAN-Hotspot + GigaTV inklusive HD Premium Plus Cable
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Kosten:
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69,89 €
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 Prozessor: Integrated Electronics Corporation - Intel Core i7-7800X
 Grafikkarte: NVIDIA Corporation GeForce GTX 1070 / NVIDIA Corporation GeForce GTX 1070
 Auflösung: 3840 x 2160 @ 60 Hz, Deep Color 30 Bit
 Mainboard: ASUSTeK Computer Inc. - ASUS Prime X299-A [90MB0U40-M0EAY0]
 Treiber: NVIDIA Corporation GeForce R411.70 WHQL (v10.18.14.1170) / NVIDIA Corporation GeForce R411.70 WHQL (v10.18.14.1170)
 OS: Microsoft Corporation Windows 10 Pro x64
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CPU
![EVGA GeForce GTX 1070 FTW GAMING ACX 3.0 [08G-P4-6276-KR]](http://pic.sysprofile.de/images/Zbv26282.gif)
