lucky1levinlucky1levin

Willkommen im sysProfile nr: 187517

Profil geändert: 10.11.2017, 16:52
Profil erstellt: 30.01.2015, 12:17
Anzahl Views: 2489

 
     







lucky1levin's System is powered by...

iNTEL ProzessorMSIAsusCorsairInfineonG.SkillMicron Technology

PanasonicHewlett PackardSamsungGalaxyEVGAnVidia GeForceRealtek

vodafoneKabel DeutschlandMicrosoft WindowsDENONMagnatAVM Fritz!LogiTech

SMC NetworksBeQuietGELIDEnermaxProlimaTechAlphacoolAvanceThermalTake

MicroSoft



Preis/Leistung

50%
Silence

100%
RechenPower

75%
GamingPower

100%
Cooles Design

100%



     
 
G.Skill Trident Z RGB F4-3866C18D-16GTZR
G.Skill Trident Z RGB F4-3866C18D-16GTZR
G.Skill Trident Z RGB F4-3866C18D-16GTZR
G.Skill Trident Z RGB F4-3866C18D-16GTZR
Intel Core i7-7800X
Intel Core i7-7800X
 
ASUS Prime X299-A
ASUS Prime X299-A
G.Skill Trident Z RGB F4-3866C18D-16GTZR
G.Skill Trident Z RGB F4-3866C18D-16GTZR
G.Skill Trident Z RGB F4-3866C18D-16GTZR
G.Skill Trident Z RGB F4-3866C18D-16GTZR
 
EVGA GeForce GTX 1070 FTW GAMING ACX 3.0 [08G-P4-6276-KR]
EVGA GeForce GTX 1070 FTW GAMING ACX 3.0 [08G-P4-6276-KR]
 

 
     




     
 
Prozessor: Integrated Electronics Corporation - Intel Core i7-7800X Sonstige Features:
Codename: Skylake-X "Basin Falls" (Integrated Electronics Corporation - Intel Skylake Microarchitecture)
Architekt.: Six-Core Processor (Integrated Electronics Corporation - Intel Core-to-Core Communication Paradigm)
Revision: H2
Tech.: 14 nm Fin Field-Effect Transistor - FinFET by Integrated Electronics Corporation - Intel
F.M.S.: Integrated Electronics Corporation - Intel Core Gen7
Instruct.: MMX(+), AES-NI, CLMUL, FMA, FMA3, Intel 64, SSE, SSE2, SSE3, SSSE3, SSE4, SSE4.1, SSE4.2, AVX, AVX2, AVX-512, TXT, TSX, SGX, NX-Bit, XD-Bit, BMI, F16C, iAMT2, VT/VT-x, Integrated Electronics Corporation - Intel Turbo Boost Max Technology 3.0, Integrated Electronics Corporation - Intel Hyper-Threading Technology, Integrated Electronics Corporation - Intel Speed Shift Technology, Integrated Electronics Corporation - Intel Active Management Technology, Enhanced Integrated Electronics Corporation - Intel SpeedStep Technology, Core-based and Package-based State, Auto Halt (C1), Enhanced Halt State (C1E), Stop Clock/Stop Grant (C2), Extended Stop Grant State (C2E), Deep Sleep (C3), Deep Sleep State (C3E), Deeper Sleep (C4), Enhanced Deeper Sleep (C4E/C5), Deep Power Down (C6), Deeper Power Down (C7)
Socket: R4 (FCLGA-2066: Flip-Chip Land Grid Array)
CPU-Takt: Core State: 1200 ~ 3500 MHz (Integrated Electronics Corporation - Intel Turbo Boost Max Technology 3.0: 4000 MHz)
Multiplik.: Integrated Electronics Corporation - Intel Mesh-of-Trees Interconnect: 12x ~ 35x (Integrated Electronics Corporation - Intel Turbo Boost Max Technology 3.0: 40x) / Integrated Electronics Corporation - Intel QuickPath Interconnect: 35x (Integrated Electronics Corporation - Intel Turbo Boost Max Technology 3.0: 40x)
FSB: Integrated Electronics Corporation - Intel Mesh-of-Trees Interconnect: 100 MHz / Integrated Electronics Corporation - Intel QuickPath Interconnect: 100 MHz
L1 Cache: 6x 32 KBytes Instruction Cache, 6x 32 KBytes Data Cache
L2 Cache: 6x 1024 KBytes
L3 Cache: 8448 KBytes
Voltage: Core State: 0,693 ~ 0,963 V (Integrated Electronics Corporation - Intel Turbo Boost Max Technology 3.0: 1,151 V)
Overclocked: Core State #48: 4800 MHz (48x 100 MHz) @ 1,310 V
Kühlung: Listan GmbH & Co. KG - be quiet! Silent Loop [BW003] [Aquatuning GmbH - Alphacool GmbH NexXxos Eiswolf / Eisbaer Ready ST30] + 2x Thermaltake Technology Co., Ltd. Riing 14 LED RGB [TT-1425] [CL-F043-PL14SW-B] (140x140x25 mm, 1400 RPM, 51,15 CFM, 28,1 dB(A), DC 12,0 V / 0,30 A / 3,60 W, Hydraulic Bearing)
Temperatur: Idle: 20 - 30 °C, Load: 50 - 65 °C w/ Thermal Interface Material: GELID Solutions Ltd. GC-Extreme & Prolimatech Inc. PK-3 Nano & Arctic Silver Inc. Céramique 2 (Tjunction @ Tcase (Integrated Electronics Corporation - Intel Platform Environment Control Interface) & Tcore (Integrated Electronics Corporation - Intel Digital Thermal Sensors))Kühler Vergleich
CPU-Z Vers.: CPUID CPU-Z 1.78.1

MainBoard: ASUSTeK Computer Inc. - ASUS Prime X299-A
Chipsatz: Integrated Electronics Corporation - Intel X299
Northbridge: Integrated Electronics Corporation - Intel Basin Falls Host Bridge/DRAM Registers (I/O Memory Management Unit) Memory Controller Hub Revision 00 + ASUSTeK Computer Inc. - ASUS DIGI+ VRM - Hybrid Digital Voltage Regulator Module w/ 4 + 2 + 4 + 2 Digital Phase Power Design (VCCIA & VCCGT PWM Controller: Infineon Technologies AG IR3555 w/ Texas Instruments Incorporated CSD97374Q4M w/ Panasonic Corporation MIL Solid Caps w/ ASUSTeK Computer Inc. - ASUS 60A Chokes; Phase Doubler & Gate Driver: Infineon Technologies AG IR35201 w/ Texas Instruments Incorporated CSD97374Q4M w/ Panasonic Corporation MIL Solid Caps w/ ASUSTeK Computer Inc. - ASUS 60A Chokes; VCCIO & VCCSA PWM Controller: Infineon Technologies AG - International Rectifier Corporation ASP1405 w/ Texas Instruments Incorporated CSD97374Q4M w/ Panasonic Corporation MIL Solid Caps w/ ASUSTeK Computer Inc. - ASUS 60A Chokes; VDDQ PWM Controller: Infineon Technologies AG - International Rectifier Corporation ASP1103 w/ Texas Instruments Incorporated CSD97374Q4M w/ Panasonic Corporation MIL Solid Caps w/ ASUSTeK Computer Inc. - ASUS 60A Chokes)
Southbridge: Integrated Electronics Corporation - Intel Union Point GL82X299 Platform Controller Hub Revision 00 & ASMedia Technology Inc. ASM3142 & ASMedia Technology Inc. ASM1543 & ASMedia Technology Inc. ASM1074 & ASMedia Technology Inc. ASM1480 & STMicroelectronics N.V. STM32 & ASUSTeK Computer Inc. - ASUS AURA 82UA0
Revision: Revision 1.xx
BiosVersion: American Megatrends Inc. - AMI Unified Extensible Firmware Interface - UEFI 0802 (System Management Basic Input/Output System - SMBIOS 3.0, Advanced Configuration and Power Interface - ACPI 6.0, Integrated Electronics Corporation - Intel Management Engine Interface, Integrated Electronics Corporation - Intel Real-time Accelerated Processing of I/O Data - Rapid Storage Technology, Integrated Electronics Corporation - Intel Direct Media Interface 3.0, ASUSTeK Computer Inc. - ASUS Dual Intelligent Processors 5 Technology, ASUSTeK Computer Inc. - ASUS PRO Clock II Technology, ASUSTeK Computer Inc. - ASUS Q-Design, ASUSTeK Computer Inc. - ASUS EZ DIY, ASUSTeK Computer Inc. - ASUS AURA Sync, ASUSTeK Computer Inc. - ASUS AI Suite 3 w/ ASUSTeK Computer Inc. - ASUS Fan Xpert 4)
Anschlüsse: 2x PCIe 3.0 x16 single @ x16 mode - dual @ x16 mode, 1x PCIe 3.0 x16 @ x8 mode, 2x PCIe 3.0 x4 @ x4 mode, 1x PCIe 3.0 x1, 8x SATA3, 1x M.2, 1x U.2, 1x USB 3.1 Gen2 LPC, 2x USB 3.1 Gen1 LPC, 1x USB 2.0 LPC, 7x PWM/DC LPCIO, 1x Thunderbolt AIC LPC, 1x MemOK! Button, 1x Power Button, 1x Dr. Debug w/ LED
extern: 2x USB 2.0 Type-A, 1x USB 3.1 Gen2 Type-C, 1x USB 3.1 Gen2 Type-A, 4x USB 3.1 Gen1 Type-A, 1x LAN (RJ-45), 1x ODT (F05), 1x Audio 5.1 (TRS), 1x USB BIOS Flashback Button
Temperatur: Idle: 30 - 35 °C, Load: 35 - 45 °C
Kühlung: ASUSTeK Computer Inc. - ASUS Ultra-efficient Heatsinks & Low Pin Count Super Input/Output Interface - LPCIO w/ Active Thermal Control - ATC: Nuvoton Technology Corp. NCT6796D

RAM: G.Skill International Enterprise Co., Ltd. Trident Z RGB F4-3866C18D-16GTZR / G.Skill International Enterprise Co., Ltd. Trident Z RGB F4-3866C18D-16GTZR
Size: 2x 8192 MB (16384 MB) / 2x 8192 MB (16384 MB)
Typ: DDR4-SDRAM (PC4-30900U) [Samsung Electronics Co., Ltd. - SEC 637 K4A8G085WB-BCPB] / DDR4-SDRAM (PC4-30900U) [Samsung Electronics Co., Ltd. - SEC 637 K4A8G085WB-BCPB]
Timing: 18-19-19-39-58-2N (CL-RCD-RP-RAS-RC-CR) / 18-19-19-39-58-2N (CL-RCD-RP-RAS-RC-CR) | Current: 14-14-14-24-38-1N (CL-RCD-RP-RAS-RC-CR)
RAM-Takt: 1933 MHz (3866 MHz) / 1933 MHz (3866 MHz) | Current: 1600 MHz (3200 MHz)
DataSpeed: 72,80 GB/s / 86,10 GB/s / 65,40 GB/s
AccessTime: 66 ns
Voltage: 1,35 V / 1,35 V | Current: 1,35 V
Ratio: 29x @133 MHz (FSB:DRAM Ratio) / 29x @133 MHz (FSB:DRAM Ratio) | Current: 24x @133 MHz (FSB:DRAM Ratio)
Temperatur: Idle: 35 - 40 °C, Load: 40 - 50 °C / Idle: 35 - 40 °C, Load: 40 - 50 °C

Grafikkarte: NVIDIA Corporation GeForce GTX 1070 / NVIDIA Corporation GeForce GTX 1070
Subvendor: EVGA Corporation GeForce GTX 1070 FTW GAMING ACX 3.0 [08G-P4-6276-KR] / EVGA Corporation GeForce GTX 1070 FTW GAMING ACX 3.0 [08G-P4-6276-KR]
Chipsatz: GP104-200-A1 (NVIDIA Corporation Pascal Microarchitecture) / GP104-200-A1 (NVIDIA Corporation Pascal Microarchitecture)
Tech.: 16 nm FinFET by Taiwan Semiconductor Manufacturing Company Limited - TSMC / 16 nm FinFET by Taiwan Semiconductor Manufacturing Company Limited - TSMC
RAM: 8192 MB GDDR5 [Micron Technology Inc. MT51J256M32HF-80:A - 6VA47-D9TCB] / 8192 MB GDDR5 [Micron Technology Inc. MT51J256M32HF-80:A - 6WA47-D9TCB]
RAM-Takt: 2002 MHz (Dual: 4004 MHz / Max: 8008 MHz) / 2002 MHz (Dual: 4004 MHz / Max: 8008 MHz)
Width: 256 Bit / 256 Bit
Bandwith: 256,30 GB/s / 256,30 GB/s
Core-Takt: 1607 MHz (NVIDIA Corporation GPU Boost 3.0: 1797 MHz) / 1607 MHz (NVIDIA Corporation GPU Boost 3.0: 1797 MHz)
Shaders: Shader Model 5.0, Microsoft Corporation DirectX 12.0 (API Feature Level 12.1), Khronos Group Inc. OpenGL 4.5, Khronos Group Inc. OpenCL 1.2, NVIDIA Corporation CUDA 8.0, NVIDIA Corporation DirectCompute 5.0, NVIDIA Corporation PureVideo HD 8 (Video Decode and Presentation API for Unix Feature Set H), Khronos Group Inc. Vulkan 1.0 / Shader Model 5.0, Microsoft Corporation DirectX 12.0 (API Feature Level 12.1), Khronos Group Inc. OpenGL 4.5, Khronos Group Inc. OpenCL 1.2, NVIDIA Corporation CUDA 8.0, NVIDIA Corporation DirectCompute 5.0, NVIDIA Corporation PureVideo HD 8 (Video Decode and Presentation API for Unix Feature Set H), Khronos Group Inc. Vulkan 1.0
Shader-Takt: 1607 MHz (NVIDIA Corporation GPU Boost 3.0: 1797 MHz) / 1607 MHz (NVIDIA Corporation GPU Boost 3.0: 1797 MHz)
Fillrate: 192,8 GTexel/s / 192,8 GTexel/s
Bus: PCI-E 3.0 x16 @ x16 3.0 / PCI-E 3.0 x16 @ x16 3.0
Anschlüsse: 1x DVI-D, 3x DisplayPort, 1x HDMI, PCIe-Power 8+8-Pin / 1x DVI-D, 3x DisplayPort, 1x HDMI, PCIe-Power 8+8-Pin
Temperatur: Idle: 25 - 35 °C, Load: 50 - 85 °C / Idle: 25 - 35 °C, Load: 50 - 85 °C
Kühlung: EVGA Corporation Active Cooling Xtreme 3.0 2x [Power Logic Technology Inc. PLD10015B12H] (100x100x15 mm, DC 12,0 V / 0,55 A / 6,60 W, Double Ball Bearing) + EVGA Corporation Digital PWM - Single Digital Voltage Regulator Module w/ 10 + 2 Digital Phase Power Design / EVGA Corporation Active Cooling Xtreme 3.0 2x [Power Logic Technology Inc. PLD10015B12H] (100x100x15 mm, DC 12,0 V / 0,55 A / 6,60 W, Double Ball Bearing) + EVGA Corporation Digital PWM - Single Digital Voltage Regulator Module w/ 10 + 2 Digital Phase Power Design
Treiber, Ver.: NVIDIA Corporation GeForce R376.33 WHQL (v10.18.13.7633)
GPU-Z Vers.: TechPowerUp GPU-Z 1.16.0

Sound: Realtek Semiconductor Corp. High Definition Audio Codec (integrated Audio Processing Unit - iAPU)
Signalproz.: ASUSTeK Computer Inc. - ASUS Crystal Sound 3 w/ Digital Theater Systems, Inc. - DTS Connect, Digital Theater Systems, Inc. - DTS Neo:PC, Digital Theater Systems, Inc. - DTS Interactive, Digital Theater Systems, Inc. - DTS Headphone:X: Realtek Semiconductor Corp. Avance Logic Codec ALC1220 (ASUSTeK Computer Inc. - ASUS SupremeFX S1220A) w/ Nichicon Corporation Fine Gold MUSE Acoustic Series
Kanäle: 6x Analog, 1x Digital
Soundmodus: 7.1 Channel Surround
Eingänge: 1x Mic (TRS), 1x AUX (TRS)
Ausgänge: 1x S/PDIF (ODT), 1x Audio 5.1 (TRS)
Abtastfreq.: max. 192 KHz @24 Bit
Boxen: Audiovox Corporation - Magnat Audio-Produkte GmbH Monitor 880 [Paar], Audio Products International Corp. - Mirage AVS-500 B-1 (Audio Products International Corp. - Mirage AVS-100, Audio Products International Corp. - Mirage AVS-200 [Paar], Audio Products International Corp. - Mirage FRx-S8)
Headset: Micro-Star International Co. Ltd. - MSI DS502 GAMING Headset, Samsung Electronics Co., Ltd. - SEC EO-EG920BW, Samsung Electronics Co., Ltd. - SEC EO-EG900BW [Samsung Electronics Co., Ltd. - SEC EO-HS3303WE]
Features: Matsushita Electric Industrial Co. Ltd. - Panasonic SA-XR58 EG-K, Nippon Columbia Co., Ltd. - Denon UDRA-M7, Samsung Electronics Co., Ltd. - SEC Galaxy S7 Edge [SM-G935F]

GehäuseTyp: Desktop
Marke: EVGA Corporation DG-87 Gaming Case [100-E1-1236-K0]
Front: 2x Thermaltake Technology Co., Ltd. Riing 14 LED RGB [TT-1425] [CL-F043-PL14SW-B] (140x140x25 mm, 1400 RPM, 51,15 CFM, 28,1 dB(A), DC 12,0 V / 0,30 A / 3,60 W, Hydraulic Bearing) + 1x Corsair Memory Inc. Air Series SP140 High Static Pressure (140x140x25 mm, 1440 RPM, 49,49 CFM, 29,3 dB(A), DC 12,0 V / 0,23 A / 2,76 W, Quad Red LEDs, Advanced Hydraulic Bearing)
Heck: 2x Thermaltake Technology Co., Ltd. Riing 14 LED RGB [TT-1425] [CL-F043-PL14SW-B] (140x140x25 mm, 1400 RPM, 51,15 CFM, 28,1 dB(A), DC 12,0 V / 0,30 A / 3,60 W, Hydraulic Bearing)
Seite: 1x Enermax Technology Corporation T.B.Vegas Quad [UCTVQ18A] (180x180x20 mm, 1200 RPM, 123,47 CFM, 20 dB(A), DC 12,0 V / 0,55 A / 6,60 W, Twister Bearing)
Oben: 3x Thermaltake Technology Co., Ltd. Riing 14 LED RGB [TT-1425] [CL-F043-PL14SW-B] (140x140x25 mm, 1400 RPM, 51,15 CFM, 28,1 dB(A), DC 12,0 V / 0,30 A / 3,60 W, Hydraulic Bearing)
Netzteil: EVGA Corporation SuperNOVA 850 T2 Power Supply [220-T2-0850-X2] (OEM: Super Flower Computer Inc.)
Leistung: 850 Watt
Kühlung: 1x Globe Electrical Industries - Globe Fan RL4Z B1402512M (140x140x25 mm, 1200 RPM, 92,16 CFM, 24,9 dB(A), DC 12,0 V / 0,30 A / 3,60 W, Double Ball Bearing) & ECO Intelligent Thermal Control (ECO ITC) w/ Ultra Quiet Fan System (Zero Fan Noise < 45 °C)
Geräusch: 18 dB(A)
WirkGrad: 94% (80+ Titanium): +3,3V = 20A / +5V = 20A / +5Vsb = 2,5A / +12V = 70,8A / -12V = 0,5A
so. Features: Casing-fans on reserve: 2x Listan GmbH & Co. KG - be quiet! Pure Wings 2 HIGH-SPEED PWM [BQ PUW2-14025-HR-PWM] (140x140x25 mm, 1600 RPM, 94,2 CFM, 16,1 dB(A), DC 12,0 V / 0,50 A / 6,0 W, Rifle Bearing) + 1x Thermaltake Technology Co., Ltd. Pure 20 [TT-2030] [CL-F015-PL20BL-A] (200x200x30 mm, 800 RPM, 129,639 CFM, 28,2 dB(A), DC 12,0 V / 0,42 A / 5,04 W, Sleeve Bearing) + 1x Thermaltake Technology Co., Ltd. Pure 14 [TT-1425] [CL-F013-PL14BL-A] (140x140x25 mm, 1000 RPM, 55,236 CFM, 20 dB(A), DC 12,0 V / 0,30 A / 3,60 W, Sleeve Bearing) + 1x EVGA Corporation RL4Z T1402512M-3M [Globe Electrical Industries - Globe Fan RLXX-Y1402512Z] (140x140x25 mm, 2000 RPM, 153,47 CFM, 39,5 dB(A), DC 12,0 V / 0,30 A / 3,60 W, Sleeve Bearing)
Bauart: Big-Tower (HPTX/E-ATX/XL-ATX)

Monitor: Samsung Electronics Co., Ltd. SyncMaster U28E850R LED [LU28E85KRS/EN]
max. Aufl.: 3840 x 2160 @ 60 Hz
Bildfläche: 28" - 623 x 345 mm (Aspect Ratio 16:9) LED
Reaktion: 1 ms
Helligkeit: 370 cd/qm
Kontrast: 1000:1
Anschlüsse: 2x HDMI, 2x DisplayPort
Leistung: 39 Watt (Energy Star 7.0)
Router: Audio Visuelles Marketing Computersysteme Vertriebs GmbH - AVM FRITZ!Box 6490 Cable

Keyboard: Logitech international S.A. Keyboard K120 (Desktop MK120)
Maus: Logitech international S.A. Mouse M120 (Desktop MK120)
Maus: Logitech international S.A. G502 Proteus Spectrum Tunable RGB-Gaming-Maus (910-004617)
Gamepad: Microsoft Corporation Xbox 360 Wireless Controller for Windows
Gamepad: Microsoft Corporation Xbox 360 Wireless Controller for Windows
Gamepad: Microsoft Corporation Xbox 360 Wireless Controller for Windows
Gamepad: Microsoft Corporation Xbox 360 Wireless Controller for Windows
Sonstiges: Microsoft Corporation Xbox 360 Wireless Gaming Receiver for Windows
Lenkrad: Guillemot Corporation - Thrustmaster T500 RS

 
     




     
 
Laufwerk: Samsung Electronics Co., Ltd. - SEC SSD 850 EVO MZ-75E500B/EU
Beschreib.: 512 MB LPDDR3-1866 (DDR3L-SDRAM) [Samsung Electronics Co., Ltd. - SEC MGX S4LN062X01-Y030]
Kapazität: 500 GB (Samsung Electronics Co., Ltd. - SEC Toggle DDR 2.0 TLC V-NAND [Samsung Electronics Co., Ltd. - SEC K90MGY8S7M])
Interface: SATA-600 | 6 Gb/s (ACS-2)
DataSpeed: 550 MB/s | 500 MB/s
AccessTime: 4KB-Q32T1: 95810 IOPS | 88400 IOPS
Temperatur: 25 - 45 °C (Samsung Electronics Co., Ltd. - SEC Dynamic Thermal Guard Protection: 70 °C)
Anschluss: SATA-600 | 6 Gb/s


Laufwerk: Samsung Electronics Co., Ltd. - SEC SSD 850 EVO MZ-75E500B/EU
Beschreib.: 512 MB LPDDR3-1866 (DDR3L-SDRAM) [Samsung Electronics Co., Ltd. - SEC MGX S4LN062X01-Y030]
Kapazität: 500 GB (Samsung Electronics Co., Ltd. - SEC Toggle DDR 2.0 TLC V-NAND [Samsung Electronics Co., Ltd. - SEC K90MGY8S7M])
Interface: SATA-600 | 6 Gb/s (ACS-2)
DataSpeed: 550 MB/s | 500 MB/s
AccessTime: 4KB-Q32T1: 95810 IOPS | 88400 IOPS
Temperatur: 25 - 45 °C (Samsung Electronics Co., Ltd. - SEC Dynamic Thermal Guard Protection: 70 °C)
Anschluss: SATA-600 | 6 Gb/s



 
     




     
 
Betriebssystem: Microsoft Corporation Windows 10 Pro x64
Display: 1920 x 1080 @ 60, True Color 32 Bit

 
     




     
 
Anschluss: EuroDOCSIS 3.0 (Data Over Cable Service Interface Specification)
DownStream: 400000 Kbps
UpStream: 25000 Kbps
Ping: 15 ms
Zugang: Audio Visuelles Marketing Computersysteme Vertriebs GmbH - AVM FRITZ!Box 6490 Cable

Provider: Vodafone Kabel Deutschland GmbH
Tarif: Red Internet & Phone 400 Cable inklusive WLAN-Hotspot + GigaTV inklusive HD Premium Plus Cable
Kosten: 69,89 €


 
     




     
 

Prozessor: Integrated Electronics Corporation - Intel Core i7-7800X

Grafikkarte: NVIDIA Corporation GeForce GTX 1070 / NVIDIA Corporation GeForce GTX 1070

Auflösung: 1920 x 1080 @ 60, True Color 32 Bit

Mainboard: ASUSTeK Computer Inc. - ASUS Prime X299-A

Treiber: NVIDIA Corporation GeForce R376.33 WHQL (v10.18.13.7633)

OS: Microsoft Corporation Windows 10 Pro x64


 
     




     
 

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