lucky1levinlucky1levin

Willkommen im sysProfile nr: 187517

Profil geändert: 07.09.2018, 19:04
Profil erstellt: 30.01.2015, 11:17
Anzahl Views: 3103

 







lucky1levin's System is powered by...

AMD ProzessoriNTEL ProzessorIntel XeonAsusInfineonG.SkillMicron Technology

SamsungGalaxyEVGAATi CrossFireNvidia SLI TechnologienVidia GeForceRealtek

vodafoneKabel DeutschlandMicrosoft WindowsDENONMagnatAVM Fritz!LogiTech

SMC NetworksNanoxiaGELIDNoctuaProlimaTechAvanceMicroSoftPanasonic

Hewlett Packard



Preis/Leistung

50%
Silence

100%
RechenPower

75%
GamingPower

100%
Cooles Design

100%



     
 
G.Skill Trident Z RGB F4-3866C18D-16GTZR
G.Skill Trident Z RGB F4-3866C18D-16GTZR
G.Skill Trident Z RGB F4-3866C18D-16GTZR
G.Skill Trident Z RGB F4-3866C18D-16GTZR
G.Skill Trident Z RGB F4-3866C18D-16GTZR
G.Skill Trident Z RGB F4-3866C18D-16GTZR
 
G.Skill Trident Z RGB F4-3866C18D-16GTZR
G.Skill Trident Z RGB F4-3866C18D-16GTZR
Intel Core i7-7800X
Intel Core i7-7800X
ASUS Prime X299-A
ASUS Prime X299-A
 
G.Skill Trident Z RGB F4-3866C18D-16GTZR
G.Skill Trident Z RGB F4-3866C18D-16GTZR
G.Skill Trident Z RGB F4-3866C18D-16GTZR
G.Skill Trident Z RGB F4-3866C18D-16GTZR
EVGA GeForce GTX 1070 FTW GAMING ACX 3.0 [08G-P4-6276-KR]
EVGA GeForce GTX 1070 FTW GAMING ACX 3.0 [08G-P4-6276-KR]
 

 




     
 
Prozessor: Integrated Electronics Corporation - Intel Core i7-7800X Sonstige Features:
Codename: Skylake-X "Sky Bay-SP" (Integrated Electronics Corporation - Intel Skylake Microarchitecture)
Architekt.: Six-Core Processor (Integrated Electronics Corporation - Intel Core-to-Core Communication Paradigm)
Revision: H2
Tech.: Integrated Electronics Corporation - Intel 3D Tri-Gate Transistor Technology: 14+ nm Fin Field-Effect Transistor - FinFET (14FF+)
F.M.S.: Integrated Electronics Corporation - Intel Core Gen7
Instruct.: MMX(+), AES-NI, CLMUL, FMA, FMA3, Intel 64, SSE, SSE2, SSE3, SSSE3, SSE4, SSE4.1, SSE4.2, AVX, AVX2, AVX-512, TXT, TSX, SGX, NX-Bit, XD-Bit, BMI, F16C, iAMT2, VT/VT-x, VT-d/Vi, Integrated Electronics Corporation - Intel Turbo Boost Technology 2.0, Integrated Electronics Corporation - Intel Hyper-Threading Technology (Thread-Level Parallelism & Instruction-Level Parallelism), Integrated Electronics Corporation - Intel Speed Shift Technology, Integrated Electronics Corporation - Intel Active Management Technology, Enhanced Integrated Electronics Corporation - Intel SpeedStep Technology, Core-based and Package-based State, Auto Halt (C1), Enhanced Halt State (C1E), Stop Clock/Stop Grant (C2), Extended Stop Grant State (C2E), Deep Sleep (C3), Deep Sleep State (C3E), Deeper Sleep (C4), Enhanced Deeper Sleep (C4E/C5), Deep Power Down (C6), Deeper Power Down (C7)
Socket: R4 (FCLGA-2066: Flip-Chip Land Grid Array)
CPU-Takt: Core State: 1200 ~ 3500 MHz (Integrated Electronics Corporation - Intel Turbo Boost Technology 2.0: 4000 MHz)
Multiplik.: Integrated Electronics Corporation - Intel Mesh-of-Trees Interconnect: 12x ~ 35x (Integrated Electronics Corporation - Intel Turbo Boost Technology 2.0: 40x) / Integrated Electronics Corporation - Intel Omni-Path Interconnect: 35x (Integrated Electronics Corporation - Intel Turbo Boost Technology 2.0: 40x)
FSB: Integrated Electronics Corporation - Intel Mesh-of-Trees Interconnect: 100 MHz / Integrated Electronics Corporation - Intel Omni-Path Interconnect: 100 MHz
L1 Cache: 6x 32 KBytes Instruction Cache, 6x 32 KBytes Data Cache
L2 Cache: 6x 1024 KBytes
L3 Cache: 8448 KBytes
Voltage: Core State: 0,693 ~ 0,963 V (Integrated Electronics Corporation - Intel Turbo Boost Technology 2.0: 1,151 V)
Besonderh.: Integrated Electronics Corporation - Intel Next-Generation Polymer Thermal Interface Material - NGPTIM, Integrated Memory Controller w/ Memory Management Unit, Unlocked Delay-Locked Loop & Unlocked Phase-Locked Loop (Variable CPU Multiplier), Integrated Electronics Corporation - Intel Power Control Unit
Overclocked: Core State #47: 4700 MHz (47x 100 MHz) @ 1,200 V
Kühlung: RASCOM Computerdistribution Ges.m.b.H. & Kolink International Corporation - Noctua NH-D15 + 3x RASCOM Computerdistribution Ges.m.b.H. & Kolink International Corporation - Noctua NF-A15 PWM (140x140x25 mm, 1500 RPM, 82,50 CFM, 24,6 dB(A), DC 12,0 V / 0,13 A / 1,56 W, Self-Stabilising Oil-Pressure Bearing 2)
Temperatur: Idle: 20 - 30 °C, Load: 45 - 100 °C w/ Thermal Interface Material: GELID Solutions Ltd. GC-Extreme & Prolimatech Inc. PK-3 Nano & Arctic Silver Inc. Céramique 2 (Tjunction @ Tcase (Integrated Electronics Corporation - Intel Platform Environment Control Interface) & Tcore (Integrated Electronics Corporation - Intel Digital Thermal Sensors))Kühler Vergleich
CPU-Z Vers.: CPUID CPU-Z 1.78.1

MainBoard: ASUSTeK Computer Inc. - ASUS Prime X299-A
Chipsatz: Integrated Electronics Corporation - Intel X299
Northbridge: Integrated Electronics Corporation - Intel Xeon (Skylake-E) M2PCI Registers (I/O Memory Management Unit) Memory Controller Hub Revision 00 + ASUSTeK Computer Inc. - ASUS DIGI+ VRM - Hybrid Digital Voltage Regulator Module w/ 8+2 Digital Phase Power Design (VCCIA 8+0/7+1/6+2 Dual-Output Digital Multi-Phase Dual-Loop PWM Controller w/ PowIRCenter GUI: Infineon Technologies AG - International Rectifier Corporation IR35201M (ASUSTeK Computer Inc. - ASUS DIGI+ VRM Energy Processing Unit: ASUSTeK Computer Inc. - ASUS ASP1405I) w/ 60A Integrated PowIRstage Synchronous Buck Gate Driver: Infineon Technologies AG - International Rectifier Corporation IR3555M w/ Panasonic Semiconductor Solutions Co., Ltd. - Panasonic Corporation MIL 10K Solid Caps w/ ASUSTeK Computer Inc. - ASUS 60A Chokes; VCCIO & VCCSA 8+0/7+1/6+2 Dual-Output Digital Multi-Phase Dual-Loop PWM Controller w/ PowIRCenter GUI: Infineon Technologies AG - International Rectifier Corporation IR35201M (ASUSTeK Computer Inc. - ASUS DIGI+ VRM Energy Processing Unit: ASUSTeK Computer Inc. - ASUS ASP1405I) w/ Multi-Phase Synchronous Buck NexFET Power Stage Converter & Gate Driver: Texas Instruments Incorporated CSD97374Q4M w/ Panasonic Semiconductor Solutions Co., Ltd. - Panasonic Corporation MIL 10K Solid Caps w/ ASUSTeK Computer Inc. - ASUS 60A Chokes; VDDQ & VDDP ASUSTeK Computer Inc. - ASUS DIGI+ VRM Energy Processing Unit: ASUSTeK Computer Inc. - ASUS ASP1103 w/ Panasonic Semiconductor Solutions Co., Ltd. - Panasonic Corporation MIL 10K Solid Caps w/ ASUSTeK Computer Inc. - ASUS 60A Chokes)
Southbridge: Integrated Electronics Corporation - Intel Union Point-H (Basin Falls) GL82X299 Platform Controller Hub Revision 00 (Lithograph: 22 nm) & 2M-Bit Serial NOR Flash Memory for CMOS-SRAM/ -EEPROM w/ Dual I/O SPI: Winbond Electronics Corporation SpiFlash W25X20CLNIG & 16-to-8 Channel Multiplexer/Demultiplexer Switch w/ Hi-Z Outputs for PCI-Express High Bandwidth Differential Protocols: ASMedia Technology Inc. ASM1480 & USB 3.1 Gen2 eXtensible Host Controller Interface & PCIe PHY: ASMedia Technology Inc. ASM3142 & USB 3.1 Type-C High Speed Digital Switch w/ Integrated CC Logic: ASMedia Technology Inc. ASM1543 & Thunderbolt 3 Controller: Integrated Electronics Corporation - Intel DSL6540 USB Type-C & USB PD Controller w/ Power Switch & High-Speed Multiplexer: Texas Instruments Incorporated TPS65982
Revision: Revision 1.xx
BiosVersion: American Megatrends Inc. - AMI Unified Extensible Firmware Interface - UEFI 5.0 / 1401 (System Management Basic Input/Output System - SMBIOS 3.0, Advanced Configuration and Power Interface - ACPI 6.0, Integrated Electronics Corporation - Intel Management Engine Interface, Integrated Electronics Corporation - Intel Real-time Accelerated Processing of I/O Data - Rapid Storage Technology, Integrated Electronics Corporation - Intel Direct Media Interface 3.0, Integrated Electronics Corporation - Intel Turbo Boost Technology 2.0, Integrated Electronics Corporation - Intel Turbo Boost Max Technology 3.0, NVIDIA Corporation SLI Technology, Advanced Micro Devices, Inc. - AMD CrossFireX Technology, ASUSTeK Computer Inc. - ASUS MultiCore Enhancement, ASUSTeK Computer Inc. - ASUS Dual Intelligent Processors 5 Technology, ASUSTeK Computer Inc. - ASUS DIGI+ Power Control, ASUSTeK Computer Inc. - ASUS PRO Clock II Technology (Phase-Locked Loop: ASUSTeK Computer Inc. - ASUS TurboV Processing Unit), ASUSTeK Computer Inc. - ASUS Q-Design, ASUSTeK Computer Inc. - ASUS EZ DIY, ASUSTeK Computer Inc. - ASUS AURA Sync, ASUSTeK Computer Inc. - ASUS AI Suite 3 w/ ASUSTeK Computer Inc. - ASUS Fan Xpert 4)
Anschlüsse: 2x PCIe 3.0 x16 single @ x16 mode - dual @ x16 mode, 1x PCIe 3.0 x16 @ x8 mode, 2x PCIe 3.0 x4 @ x4 mode, 1x PCIe 3.0 x1, 8x SATA3, 2x M.2, 1x USB 3.1 Gen2 LPC, 2x USB 3.1 Gen1 LPC, 1x USB 2.0 LPC, 7x PWM/DC LPCIO, 1x Thunderbolt AIC LPC, EATXPWR 24-Pin, EATX12V 8+4-Pin, 1x MemOK! Button, 1x Power Button, 1x Dr. Debug w/ LED
extern: 2x USB 2.0 Type-A, 1x USB 3.1 Gen2 Type-C, 1x USB 3.1 Gen2 Type-A, 4x USB 3.1 Gen1 Type-A, 1x LAN (RJ-45), 1x ODT (F05), 1x Audio 5.1 (TRS), 1x USB BIOS Flashback Button
Temperatur: Idle: 30 - 35 °C, Load: 35 - 45 °C
Kühlung: ASUSTeK Computer Inc. - ASUS Ultra-efficient Heatsinks + Low Pin Count Super Input/Output Interface - LPCIO w/ Active Thermal Control - ATC: Nuvoton Technology Corp. NCT6796D + PWM/DC Hardware Monitoring IC w/ PECI 3.0 Interface & Multifunctional GPIO & Smart Fan IV Mode: Nuvoton Technology Corp. NCT7802Y

RAM: G.Skill International Enterprise Co., Ltd. Trident Z RGB F4-3866C18D-16GTZR / G.Skill International Enterprise Co., Ltd. Trident Z RGB F4-3866C18D-16GTZR
Size: 2x 8192 MB (16384 MB) / 2x 8192 MB (16384 MB)
Typ: DDR4-SDRAM (PC4-30900U) [Samsung Semiconductor, Inc. - Samsung Electronics Co., Ltd. - SEC 637 K4A8G085WB-BCPB] / DDR4-SDRAM (PC4-30900U) [Samsung Semiconductor, Inc. - Samsung Electronics Co., Ltd. - SEC 637 K4A8G085WB-BCPB]
Timing: Nominal: 18-19-19-39-58-2N (CL-RCD-RP-RAS-RC-CR) | Quad Channel: 18-19-19-39-58-2N (CL-RCD-RP-RAS-RC-CR) | Quad Channel: 15-16-15-35-50-1N (CL-RCD-RP-RAS-RC-CR) | Dual Channel: 18-19-19-39-58-2N (CL-RCD-RP-RAS-RC-CR) | Dual Channel: 15-16-15-35-50-1N (CL-RCD-RP-RAS-RC-CR)
RAM-Takt: Nominal: 1933 MHz (3866 MHz) | Quad Channel: 1900 MHz (3800 MHz) | Quad Channel: 1600 MHz (3200 MHz) | Dual Channel: 1900 MHz (3800 MHz) | Dual Channel: 1600 MHz (3200 MHz)
DataSpeed: Quad Channel: 76,710 GB/s / 93,490 GB/s / 66,725 GB/s | Quad Channel: 71,705 GB/s / 84,700 GB/s / 64,830 GB/s | Dual Channel: 53,660 GB/s / 52,840 GB/s / 46,225 GB/s | Dual Channel: 45,885 GB/s / 44,830 GB/s / 40,465 GB/s
AccessTime: Quad Channel: 66 ns | Quad Channel: 70 ns | Dual Channel: 64 ns | Dual Channel: 66 ns
Voltage: Nominal: 1,35 V | Quad Channel: 1,40 V | Quad Channel: 1,40 V | Dual Channel: 1,35 V | Dual Channel: 1,35 V
Ratio: Nominal: 29x @133 MHz (FSB:DRAM Ratio) | Quad Channel: 38x @100 MHz (FSB:DRAM Ratio) | Quad Channel: 24x @133 MHz (FSB:DRAM Ratio) | Dual Channel: 38x @100 MHz (FSB:DRAM Ratio) | Dual Channel: 24x @133 MHz (FSB:DRAM Ratio)
Temperatur: Idle: 35 - 40 °C, Load: 40 - 50 °C / Idle: 35 - 40 °C, Load: 40 - 50 °C

Grafikkarte: NVIDIA Corporation GeForce GTX 1070 / NVIDIA Corporation GeForce GTX 1070
Subvendor: EVGA Corporation GeForce GTX 1070 FTW GAMING ACX 3.0 [08G-P4-6276-KR] / EVGA Corporation GeForce GTX 1070 FTW GAMING ACX 3.0 [08G-P4-6276-KR]
Chipsatz: GP104-200-A1 (NVIDIA Corporation Pascal Microarchitecture) / GP104-200-A1 (NVIDIA Corporation Pascal Microarchitecture)
Tech.: 16 nm FinFET Streaming Multiprocessor Pascal (SMP) by Taiwan Semiconductor Manufacturing Company Limited - TSMC / 16 nm FinFET Streaming Multiprocessor Pascal (SMP) by Taiwan Semiconductor Manufacturing Company Limited - TSMC
RAM: 8192 MB GDDR5-SGRAM [Micron Technology Inc. MT51J256M32HF-80:A - 6WA47-D9TCB] / 8192 MB GDDR5-SGRAM [Micron Technology Inc. MT51J256M32HF-80:A - 6WA47-D9TCB]
RAM-Takt: 2002 MHz (Dual: 4004 MHz / Effective: 8008 MHz) / 2002 MHz (Dual: 4004 MHz / Effective: 8008 MHz)
Width: 256 Bit / 256 Bit
Bandwith: 256,30 GB/s / 256,30 GB/s
Core-Takt: 1607 MHz (NVIDIA Corporation GPU Boost 3.0: 1797 MHz) / 1607 MHz (NVIDIA Corporation GPU Boost 3.0: 1797 MHz)
Shaders: Shader Model 5.0, Microsoft Corporation DirectX 12.0 (API Feature Level 12.1), Khronos Group Inc. OpenGL 4.5, Khronos Group Inc. OpenCL 1.2, NVIDIA Corporation CUDA 8.0, NVIDIA Corporation DirectCompute 5.0, NVIDIA Corporation PureVideo HD 8 (Video Decode and Presentation API for Unix Feature Set H), Khronos Group Inc. Vulkan 1.0 / Shader Model 5.0, Microsoft Corporation DirectX 12.0 (API Feature Level 12.1), Khronos Group Inc. OpenGL 4.5, Khronos Group Inc. OpenCL 1.2, NVIDIA Corporation CUDA 8.0, NVIDIA Corporation DirectCompute 5.0, NVIDIA Corporation PureVideo HD 8 (Video Decode and Presentation API for Unix Feature Set H), Khronos Group Inc. Vulkan 1.0
Shader-Takt: 1607 MHz (NVIDIA Corporation GPU Boost 3.0: 1797 MHz) /1607 MHz (NVIDIA Corporation GPU Boost 3.0: 1797 MHz)
Fillrate: 192,8 GTexel/s / 192,8 GTexel/s
Bus: PCI-E 3.0 x16 @ x16 3.0 / PCI-E 3.0 x16 @ x16 3.0
Anschlüsse: 1x DVI-D, 3x DisplayPort, 1x HDMI, High-Bandwidth SLI 26+26-Pin, PCIe-Power 8+8-Pin / 1x DVI-D, 3x DisplayPort, 1x HDMI, High-Bandwidth SLI 26+26-Pin, PCIe-Power 8+8-Pin
Temperatur: Idle: 25 - 35 °C, Load: 50 - 85 °C / Idle: 25 - 35 °C, Load: 50 - 85 °C
Kühlung: EVGA Corporation Active Cooling Xtreme 3.0 - ACX 3.0 w/ 2x [Power Logic Technology Inc. PLD10015B12H] (100x100x15 mm, 3250 RPM, DC 12,0 V / 0,55 A / 6,60 W, Double Ball Bearing) + EVGA Corporation Digital PWM - Hybrid Digital Voltage Regulator Module w/ 10+2 Digital Phase Power Design (VDDC 5+0 Multi-Phase Synchronous Buck PWM Controller: ON Semiconductor Corporation NPC81274 w/ Integrated Driver & MOSFET: ON Semiconductor Corporation NCP81382; VDDC Current Balancing Multi-Phase Doubler w/ Gate Driver & Power Driver: ON Semiconductor Corporation NCP81162; VDDQ 2-Phase Synchronous Buck PWM Controller w/ Integrated Gate Drivers & PWM VID Interface: ON Semiconductor Corporation NPC81278 w/ ON Semiconductor Corporation NTMFD4C85N; Power Monitor: Texas Instruments Incorporated INA3221) / EVGA Corporation Active Cooling Xtreme 3.0 - ACX 3.0 w/ 2x [Power Logic Technology Inc. PLD10015B12H] (100x100x15 mm, 3250 RPM, DC 12,0 V / 0,55 A / 6,60 W, Double Ball Bearing) + EVGA Corporation Digital PWM - Hybrid Digital Voltage Regulator Module w/ 10+2 Digital Phase Power Design (VDDC 5+0 Multi-Phase Synchronous Buck PWM Controller: ON Semiconductor Corporation NPC81274 w/ Integrated Driver & MOSFET: ON Semiconductor Corporation NCP81382; VDDC Current Balancing Multi-Phase Doubler w/ Gate Driver & Power Driver: ON Semiconductor Corporation NCP81162; VDDQ 2-Phase Synchronous Buck PWM Controller w/ Integrated Gate Drivers & PWM VID Interface: ON Semiconductor Corporation NPC81278 w/ ON Semiconductor Corporation NTMFD4C85N; Power Monitor: Texas Instruments Incorporated INA3221)
Treiber, Ver.: NVIDIA Corporation GeForce R391.35 WHQL (v10.18.13.9135) / NVIDIA Corporation GeForce R391.35 WHQL (v10.18.13.9135)
GPU-Z Vers.: TechPowerUp GPU-Z 1.16.0

Sound: Realtek Semiconductor Corp. High Definition Audio Codec (integrated Audio Processing Unit - iAPU)
Signalproz.: ASUSTeK Computer Inc. - ASUS Crystal Sound 3 w/ Digital Theater Systems, Inc. - DTS Connect, Digital Theater Systems, Inc. - DTS Neo:PC, Digital Theater Systems, Inc. - DTS Interactive, Digital Theater Systems, Inc. - DTS Headphone:X: Realtek Semiconductor Corp. Avance Logic Codec ALC1220 (ASUSTeK Computer Inc. - ASUS SupremeFX S1220A w/ integrated Operational Amplifier (iVRMS)) w/ Nichicon Corporation Fine Gold MUSE Acoustic Series
Kanäle: 6x Analog, 1x Digital
Soundmodus: 7.1 Channel Surround
Eingänge: 1x Mic (TRS), 1x AUX (TRS)
Ausgänge: 1x S/PDIF (ODT), 1x Audio 5.1 (TRS)
Abtastfreq.: max. 192 KHz @24 Bit
Boxen: Audiovox Corporation - Magnat Audio-Produkte GmbH Monitor 880 [Paar], Audio Products International Corp. - Mirage AVS-500 B-1 (Audio Products International Corp. - Mirage AVS-100, Audio Products International Corp. - Mirage AVS-200 [Paar], Audio Products International Corp. - Mirage FRx-S8)
Headset: Samsung Electronics Co., Ltd. - SEC EO-EG920BW, Samsung Electronics Co., Ltd. - SEC EO-EG900BW [Samsung Electronics Co., Ltd. - SEC EO-HS3303WE]
Features: Matsushita Electric Industrial Co. Ltd. - Panasonic SA-XR58 EG-K, Nippon Columbia Co., Ltd. - Denon UDRA-M7, Samsung Electronics Co., Ltd. - SEC Galaxy S7 Edge [SM-G935F]

GehäuseTyp: Desktop
Marke: EVGA Corporation DG-87 Gaming Case [100-E1-1236-K0]
Front: 3x RASCOM Computerdistribution Ges.m.b.H. & Kolink International Corporation - Noctua NF-A14 PWM (140x140x25 mm, 1500 RPM, 82,50 CFM, 24,6 dB(A), DC 12,0 V / 0,13 A / 1,56 W, Self-Stabilising Oil-Pressure Bearing 2)
Heck: 2x RASCOM Computerdistribution Ges.m.b.H. & Kolink International Corporation - Noctua NF-A14 PWM (140x140x25 mm, 1500 RPM, 82,50 CFM, 24,6 dB(A), DC 12,0 V / 0,13 A / 1,56 W, Self-Stabilising Oil-Pressure Bearing 2)
Oben: 3x RASCOM Computerdistribution Ges.m.b.H. & Kolink International Corporation - Noctua NF-A14 PWM (140x140x25 mm, 1500 RPM, 82,50 CFM, 24,6 dB(A), DC 12,0 V / 0,13 A / 1,56 W, Self-Stabilising Oil-Pressure Bearing 2)
Netzteil: EVGA Corporation SuperNOVA 850 T2 Power Supply [220-T2-0850-X2] (OEM: Super Flower Computer Inc.)
Leistung: 850 Watt
Kühlung: 1x Globe Electrical Industries - Globe Fan RL4Z B1402512M (140x140x25 mm, 1200 RPM, 92,16 CFM, 24,9 dB(A), DC 12,0 V / 0,30 A / 3,60 W, Double Ball Bearing) & ECO Intelligent Thermal Control (ECO ITC) w/ Ultra Quiet Fan System (Zero Fan Noise < 45 °C)
Geräusch: 18 dB(A)
WirkGrad: 94% (80+ Titanium): +3,3V = 20A / +5V = 20A / +5Vsb = 2,5A / +12V = 70,8A / -12V = 0,5A
so. Features: Accessories for connections: 8x RASCOM Computerdistribution Ges.m.b.H. & Kolink International Corporation - Noctua NA-SEC1 Extension Cables + 10x RASCOM Computerdistribution Ges.m.b.H. & Kolink International Corporation - Noctua NA-SRC7 Low-Noise Adaptors + 9x RASCOM Computerdistribution Ges.m.b.H. & Kolink International Corporation - Noctua NA-SYC1 Y-Cables / Accessories for cases: 2x PC-Cooling GmbH - Nanoxia LED Rigid Bar RGB [NRLED30RGB]
Bauart: Big-Tower (HPTX/E-ATX/XL-ATX)

Monitor: Samsung Electronics Co., Ltd. SyncMaster U28E850R LED [LU28E85KRS/EN]
max. Aufl.: 3840 x 2160 @ 60 Hz
Bildfläche: 28" - 623 x 345 mm (Aspect Ratio 16:9) LED
Reaktion: 1 ms
Helligkeit: 370 cd/qm
Kontrast: 1000:1
Anschlüsse: 2x HDMI, 2x DisplayPort
Leistung: 39 Watt (Energy Star 7.0)
Router: Audio Visuelles Marketing Computersysteme Vertriebs GmbH - AVM FRITZ!Box 6490 Cable

Keyboard: Logitech international S.A. Keyboard K120 (Desktop MK120)
Maus: Logitech international S.A. Mouse M120 (Desktop MK120)
Maus: Logitech international S.A. G502 Proteus Spectrum Tunable RGB-Gaming-Maus (910-004617)
Gamepad: Microsoft Corporation Xbox 360 Wireless Controller for Windows
Gamepad: Microsoft Corporation Xbox 360 Wireless Controller for Windows
Gamepad: Microsoft Corporation Xbox 360 Wireless Controller for Windows
Gamepad: Microsoft Corporation Xbox 360 Wireless Controller for Windows
Sonstiges: Microsoft Corporation Xbox 360 Wireless Gaming Receiver for Windows
Lenkrad: Guillemot Corporation - Thrustmaster T500 RS

 




     
 
Laufwerk: Samsung Electronics Co., Ltd. - SEC SSD 850 EVO MZ-75E500B/EU
Beschreib.: 512 MB 933 MHz (1866 MHz) DDR3L-SDRAM / LPDDR3-1866 (PC3L-14900S) [Samsung Electronics Co., Ltd. - SEC MGX S4LN062X01-Y030]
Kapazität: 500 GB (Samsung Electronics Co., Ltd. - SEC Toggle DDR 2.0 TLC V-NAND [Samsung Electronics Co., Ltd. - SEC K90MGY8S7M])
Interface: SATA-600 | 6 Gb/s (ACS-2)
DataSpeed: 550 MB/s | 500 MB/s
AccessTime: 4KB-Q32T1: 95810 IOPS | 88400 IOPS
Temperatur: 25 - 45 °C (Samsung Electronics Co., Ltd. - SEC Dynamic Thermal Guard Protection: 70 °C)
Anschluss: SATA-600 | 6 Gb/s


Laufwerk: Samsung Electronics Co., Ltd. - SEC SSD 850 EVO MZ-75E500B/EU
Beschreib.: 512 MB 933 MHz (1866 MHz) DDR3L-SDRAM / LPDDR3-1866 (PC3L-14900S) [Samsung Electronics Co., Ltd. - SEC MGX S4LN062X01-Y030]
Kapazität: 500 GB (Samsung Electronics Co., Ltd. - SEC Toggle DDR 2.0 TLC V-NAND [Samsung Electronics Co., Ltd. - SEC K90MGY8S7M])
Interface: SATA-600 | 6 Gb/s (ACS-2)
DataSpeed: 550 MB/s | 500 MB/s
AccessTime: 4KB-Q32T1: 95810 IOPS | 88400 IOPS
Temperatur: 25 - 45 °C (Samsung Electronics Co., Ltd. - SEC Dynamic Thermal Guard Protection: 70 °C)
Anschluss: SATA-600 | 6 Gb/s



 




     
 
Betriebssystem: Microsoft Corporation Windows 10 Pro x64
Display: 1920 x 1080 @ 60, True Color 32 Bit

 




     
 
Anschluss: EuroDOCSIS 3.0 (Data Over Cable Service Interface Specification)
DownStream: 400000 Kbps
UpStream: 25000 Kbps
Ping: 15 ms
Zugang: Audio Visuelles Marketing Computersysteme Vertriebs GmbH - AVM FRITZ!Box 6490 Cable

Provider: Vodafone Kabel Deutschland GmbH
Tarif: Red Internet & Phone 400 Cable inklusive WLAN-Hotspot + GigaTV inklusive HD Premium Plus Cable
Kosten: 69,89 €


 




     
 

Prozessor: Integrated Electronics Corporation - Intel Core i7-7800X

Grafikkarte: NVIDIA Corporation GeForce GTX 1070 / NVIDIA Corporation GeForce GTX 1070

Auflösung: 1920 x 1080 @ 60, True Color 32 Bit

Mainboard: ASUSTeK Computer Inc. - ASUS Prime X299-A

Treiber: NVIDIA Corporation GeForce R391.35 WHQL (v10.18.13.9135) / NVIDIA Corporation GeForce R391.35 WHQL (v10.18.13.9135)

OS: Microsoft Corporation Windows 10 Pro x64


 




     
 

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